Heat Dissipation Unit for Display Panel Temperature Uniformity
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Solution Overview
Problem
Display devices face challenges in maintaining uniform temperature across the panel, leading to temperature deviations, recognizable spots, and color differences due to heat concentration in specific areas, which affect display quality.
Innovation Solution
A display device design incorporating a heat dissipation unit between the display panel and the cover bottom, with flexible films connecting the printed circuit board and the panel, and a heat dissipation unit that overlaps these films to uniformly disperse heat generated by the printed circuit board, reducing temperature deviations and improving display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a printed circuit board is disposed on the rear surface of the display panel, then electrical connection and control functions are improved, but heat concentration occurs in specific areas causing temperature deviation and display quality degradation
Solution Approach 1:
A heat dissipation unit is introduced as an intermediary component between the printed circuit board and the display panel. This heat dissipation unit includes a heat dissipation member that contacts the printed circuit board to receive heat, and a heat transmission member that transfers the heat to a heat receiving member, thereby mediating the heat flow and preventing direct heat concentration on the display panel.
Solution Approach 2:
The heat dissipation unit is divided into multiple functional segments: a heat dissipation member for receiving heat from the printed circuit board, a heat transmission member for transferring heat, and a heat receiving member for absorbing and dispersing heat. This segmentation allows each component to perform its specific heat management function efficiently.
2Ease of operation
If heat is generated in the printed circuit board area, then device functionality is maintained, but recognizable spots and color differences appear due to temperature difference
Solution Approach 1:
The heat dissipation unit acts as an intermediary thermal management system that allows the printed circuit board to maintain its functionality while preventing the harmful thermal effects from reaching the display panel, thus preserving both device operation and display quality.
Solution Approach 2:
The heat generated by the printed circuit board, which is initially harmful, is converted into a manageable thermal flow by the heat dissipation unit. The heat is systematically transmitted and dispersed, transforming a harmful concentration into a beneficial uniform distribution that does not affect display quality.
3Area of stationary object
If the display panel area is increased, then display coverage is improved, but heat dispersion becomes less effective leading to greater temperature deviation
Solution Approach 1:
The heat dissipation unit introduces a new thermal management dimension by adding vertical heat transfer pathways through multiple layers (heat dissipation member, heat transmission member, heat receiving member). This multi-dimensional approach to heat management allows effective heat dispersion across larger display areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes temperature deviations and recognizable spots, enhancing display quality by ensuring uniform heat distribution across the display panel, thereby improving image consistency and reducing the risk of color differences.
Implementation Method 1
a heat dissipation unit disposed between the display panel and the cover bottom. The heat dissipation unit may overlap the plurality of flexible films to uniformly disperse heat generated in the printed circuit board to a cover shield
Data Source
AI summary
A display device may include a display panel; a cover bottom on a rear surface of the display panel and including a first opening; a plate bottom on the rear surface of the display panel and overlapping the first opening; a printed circuit board on a rear surface of the plate bottom and connected to the display panel; a plurality of flexible films connecting the printed circuit board and the display panel; and a heat dissipation unit disposed between the display panel and the cover bottom. The heat dissipation unit may overlap the plurality of flexible films.