Display Panel Heat Dissipation Film Pattern Recognition Hole Design
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Solution Overview
Problem
Existing full-screen display devices face challenges in achieving uniform brightness and preventing display shadows due to uneven charge distribution, particularly in the pattern recognition region.
Innovation Solution
A display panel design that includes a heat dissipation film with a pattern recognition hole and a conductive portion on the hole wall, which connects the conductive layer to the connection portion, ensuring even charge distribution and preventing shadows.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation film with conductive layer is applied to the display substrate, then heat dissipation performance is improved, but charge distribution uniformity deteriorates causing display shadows
Solution Approach 1:
The conductive layer is segmented by creating pattern recognition holes that penetrate through it, dividing the continuous conductive layer into isolated regions. This segmentation allows different areas to have different charge distribution characteristics, preventing charge accumulation that causes display shadows while maintaining heat dissipation functionality.
Solution Approach 2:
The conductive material is extracted from the pattern recognition hole regions, removing the source of charge accumulation in critical areas. By taking out the conductive layer selectively at pattern recognition holes, the invention eliminates the harmful charge distribution uniformity issue while preserving the overall heat dissipation capability of the conductive layer.
2Temperature
If the pattern recognition region is covered by heat dissipation film, then heat dissipation is improved, but pattern recognition accuracy deteriorates due to interference
Solution Approach 1:
The heat dissipation film is segmented by creating pattern recognition holes that penetrate through the conductive layer and adhesive layer. This segmentation exposes specific regions (pattern recognition regions) where light can pass through to the sensor below, allowing pattern recognition to function accurately while the rest of the film continues to provide heat dissipation.
Solution Approach 2:
The heat dissipation film material is extracted at the pattern recognition hole locations, removing the interfering material that would block light and sensor operation. This extraction creates clear optical paths for pattern recognition while maintaining the heat dissipation function in the surrounding areas of the film.
3Measurement precision
If the pattern recognition hole is made larger to improve sensor exposure, then pattern recognition accuracy is improved, but structural stability of the heat dissipation film deteriorates
Solution Approach 1:
The heat dissipation film is designed with local quality variations: the adhesive layer is made thicker at the pattern recognition hole edges to provide local reinforcement and structural support. This localized thickening compensates for the structural weakness created by larger holes, maintaining overall film stability while allowing sufficient hole size for accurate pattern recognition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the difference in induced charge distribution, eliminating display shadows and ensuring uniform brightness in the pattern recognition region, thereby enhancing user experience.
Implementation Method 1
The conductive portion is disposed at least on a hole wall of the pattern recognition hole, and an end of the conductive portion is connected to the conductive layer, and another end of the conductive portion is connected to the connection portion
Implementation Method 2
The heat dissipation film includes an adhesive layer, a heat conduction layer and a conductive layer that are away from the display substrate in sequence
Data Source
AI summary
A display panel has a pattern recognition region. The display panel includes a heat dissipation film, a connection portion, and a conductive portion. The heat dissipation film includes an adhesive layer, a heat conduction layer, and a conductive layer that are away from a display substrate in sequence. The heat dissipation film further includes a pattern recognition hole penetrating the adhesive layer, the heat conduction layer, and the conductive layer. A surface of the connection portion away from the display substrate is exposed by the pattern recognition hole. The connection portion is included in the display substrate, or is located outside the display substrate. The conductive portion is disposed at least on a hole wall of the pattern recognition hole, and an end of the conductive portion is connected to the conductive layer, and another end of the conductive portion is connected to the connection portion.