Display Panel Substrate With Embedded IC Shielding and Narrow Seams
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Solution Overview
Problem
Existing LED display technologies face challenges in reducing seams between tiled modules and managing electromagnetic interference (EMI) due to high frequency demands for PWM, which complicates EMC management.
Innovation Solution
A display panel design featuring a novel matrix circuit substrate with integrated EMI shielding and a conductive layer that does not physically contact embedded circuits, combined with flexible conductors on the backside to minimize pixel pitch and reduce electronic component space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If TFT-on-glass design is used to reduce pixel size, then pixel pitch can be decreased, but space for electronics and EMI management becomes more challenging
Solution Approach 1:
The patent combines EMI shielding functionality with the existing conductive layers (such as ITO or other transparent conductive oxides) already present in the TFT-on-glass display structure. By integrating EMI shielding into the existing conductive layers rather than adding separate shielding components, the design maintains small pixel pitch while managing EMI complexity within the same structural framework.
2Device complexity
If multiple light sources are collected into banks with common contacts, then component count is reduced, but PWM requires higher frequency leading to higher EMI
Solution Approach 1:
The patent converts the harmful EMI generated by high-frequency PWM signals into a manageable parameter by using the same conductive layers that generate the EMI to provide shielding. The conductive ITO layers or other transparent conductive oxides serve dual purposes: enabling the high-frequency PWM signals for banked light source control while simultaneously providing EMI shielding to contain or redirect the generated electromagnetic interference.
3Length of moving object
If seams between tiled modules are decreased, then display quality improves, but space for electronics and connections is reduced
Solution Approach 1:
The patent merges the functions of connection terminals and EMI shielding into the same conductive structures. The connection terminals at the module edges utilize the existing transparent conductive oxide layers, eliminating the need for separate shielding structures and reducing the overall space required for both connections and EMI management in the seam region.
4Length of moving object
If via holes are used for front-back connection, then pixel pitch can be reduced, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the connection function from the substrate thickness direction (via holes) and relocates it to the lateral edges of the module. By placing connection terminals at the edges rather than drilling through-substrate via holes, the design achieves small pixel pitch without the manufacturing complexity of deep via hole formation, while still enabling front-to-back electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a thinner, lighter structure with reduced seams and effective EMI shielding, allowing for smaller pixel pitch and reduced assembly time, while minimizing the need for additional EMI management.
Implementation Method 1
an electrically conductive layer that covers at least a part of the front side of the at least one substrate and surrounds the plurality of electrical components, where the electrically conductive layer does not physically contact the embedded integrated circuits and provides EMI shielding to different components of the display panel
Data Source
AI summary
A display panel and a method for manufacturing a display panel that includes a front side and a back side, the display panel including a substrate having a plurality of electrical components provided on a front side of the substrate and integrated circuits connected to the plurality of electrical components, the integrated circuits being embedded in the substrate. A plurality of edge contacts is also provided along edges of the substrate, where the plurality of edge contacts is electrically connected with the integrated circuits. An electrically conductive layer covers at least a part of the front side of the substrate and surrounds the plurality of electrical components, where the electrically conductive layer does not physically contact the embedded integrated circuits and provides EMI shielding to different components of the display panel.