Display Panel Assembly with In-Chamber Alignment, Bonding, and Test
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Solution Overview
Problem
Existing display device manufacturing processes are complex and inefficient, lacking a streamlined method for aligning, bonding, and testing components within a unified chamber environment.
Innovation Solution
A method and system that integrates an alignment apparatus, bonding apparatus, and test apparatus within a single chamber to align and bond first and second panels, perform lighting tests on mother panels, and generate defect management maps, simplifying the manufacturing process by aligning and testing multiple panels sequentially and separating only good panels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple separate apparatuses are used for alignment, bonding, and testing, then each process can be performed with dedicated equipment, but the manufacturing process becomes complex and inefficient
Solution Approach 1:
The patent combines alignment apparatus, bonding apparatus, and test apparatus into a single integrated manufacturing system. The alignment apparatus includes a positioning stage for aligning panels, a bonding head for bonding components, and a testing unit for functional verification, all operating within one chamber. This merging eliminates the need for multiple separate facilities and streamlines the manufacturing workflow.
Solution Approach 2:
The alignment apparatus is designed with multi-functional capabilities to perform alignment, bonding, and testing operations. The positioning stage can adjust panel positions for alignment, the bonding head can apply bonding material and activate bonding, and the testing unit can verify functional performance. This universal design allows a single apparatus to replace multiple specialized equipment.
2Productivity
If panels are processed individually through separate alignment, bonding, and testing steps, then each step can be optimized, but processing time and productivity are reduced
Solution Approach 1:
The integrated apparatus enables continuous processing where alignment, bonding, and testing are performed in sequence without removing panels from the chamber. The positioning stage continuously adjusts panel positions, the bonding head continuously applies bonding operations, and the testing unit continuously verifies functionality. This continuous action eliminates idle time between processes and maximizes productivity.
Solution Approach 2:
The apparatus performs preliminary alignment and positioning of panels before bonding operations. The positioning stage pre-aligns panels to precise positions, and the system prepares bonding parameters in advance. This preliminary action ensures that subsequent bonding and testing proceed efficiently without requiring re-adjustments or re-positioning.
3Productivity
If all panels are processed through the complete manufacturing process, then maximum output is achieved, but defective panels are produced alongside good panels
Solution Approach 1:
The testing unit provides real-time feedback on panel functionality during the manufacturing process. When a panel fails the functional test, the system immediately identifies it as defective and prevents further processing or inclusion in the final output. This feedback mechanism allows the system to distinguish between good and defective panels, ensuring only functional panels are produced while minimizing waste.
Solution Approach 2:
The testing unit performs functional verification at an early stage in the manufacturing process, before final assembly or shipping preparations. This preliminary testing identifies defective panels early, allowing them to be separated from good panels before significant resources are invested in further processing or packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process by allowing simultaneous alignment, bonding, and testing of display panels within a unified chamber, improving efficiency and reducing waste by separating only functional panels.
Implementation Method 1
The bonding of the end portion of the at least one of the light emitting elements to the pixel electrode may include irradiating laser light or applying heat between the end portion of the at least one of the light emitting elements and the pixel electrode.
Implementation Method 2
The bonding of the end portion of the at least one of the light emitting elements to the pixel electrode may include irradiating laser light or applying heat between the end portion of the at least one of the light emitting elements and the pixel electrode.
Data Source
AI summary
In a method of manufacturing a display device, first and second panels are aligned by using an alignment apparatus. The first panel includes pixel driving circuits arranged on a first substrate, each of the pixel driving circuits includes a transistor and a pixel electrode connected to the transistor, and the second panel includes light emitting elements arranged on a second substrate. An end portion of at least one of the light emitting elements is bonded to the pixel electrode by using a bonding apparatus, and a lighting test is performed on a mother panel by using a test apparatus. The mother panel includes the first panel and the second panel, and is divided into a plurality of display panels in plan view. A defect management map for the plurality of display panels is generated based on a result of the lighting test.