Mini-LED Display Panel Bonding Pad Geometry for Reflective Ink Curing
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Solution Overview
Problem
The reflective ink in display panels using mini-light-emitting diode technology is not completely cured due to insufficient light exposure, leading to undercut-shaped structures that reduce reflectivity by 15% to 20%, affecting the display effect and energy consumption.
Innovation Solution
The display panel incorporates frustum-shaped bonding pads with inclined surfaces to reflect curing light onto the reflective layer, ensuring complete curing of the photocuring reflective ink, which is disposed between the bonding pads. This configuration enhances the reflectivity of the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the coating thickness of the reflective ink is increased to about 60 microns to maximize reflectivity, then the reflectivity of the display panel is improved, but the reflective ink cannot be completely cured due to insufficient light exposure, leading to undercut-shaped structures that reduce reflectivity by 15% to 20%
Solution Approach 1:
The bonding pads are designed with inclined side surfaces instead of vertical walls, changing the geometric dimension from a cylindrical shape to a frustum shape. This dimensional change allows curing light to reflect off the inclined surfaces and reach the bottom portions of the reflective ink that would otherwise be in shadow, enabling complete curing while maintaining high reflectivity with thicker coating
Solution Approach 2:
The inclined side surfaces of the bonding pads act as intermediary reflective surfaces that redirect curing light onto the reflective ink. These inclined surfaces serve as mediators that transfer light energy to areas that would otherwise remain uncured, solving the contradiction between thick coating for high reflectivity and complete curing
2Illumination intensity
If the coating thickness of the reflective ink is increased to about 60 microns to maximize reflectivity, then the reflectivity of the display panel is improved, but undercut-shaped structures are formed that reduce the display effect
Solution Approach 1:
By changing the bonding pad geometry from vertical-sided to inclined-sided (frustum shape), the patent eliminates the undercut defect while maintaining the desired thick reflective ink coating. This dimensional modification prevents the formation of harmful undercut structures during the curing process
3Illumination intensity
If the coating thickness of the reflective ink is increased to about 60 microns to maximize reflectivity, then the reflectivity of the display panel is improved, but energy consumption is not reduced as expected due to incomplete curing
Solution Approach 1:
The inclined side surfaces enable complete curing of the thick reflective ink coating, ensuring that the high reflectivity (above 92.5%) is achieved and maintained. This complete curing prevents energy waste from uncured material while maximizing light reflection to reduce display energy consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The complete curing of the reflective ink results in a reflectivity above 92.5%, improving the display effect and reducing energy consumption, while preventing the formation of undercut-shaped structures.
Implementation Method 1
The bonding pads are frustum-shaped and have high-reflectivity inclined surfaces... to reflect curing light onto the reflective layer
Implementation Method 2
a material of the reflective layer includes photocuring reflective ink... ensuring complete curing of the photocuring reflective ink
Data Source
AI summary
A display panel includes a driving substrate, a plurality of bonding pads, a reflective layer, and a plurality of light-emitting units. The driving substrate includes a plurality of wirings of a driving circuit of the display panel. The bonding pads are disposed on the driving substrate and is electrically connected to the wirings of the driving circuit in the driving substrate. Every two of the bonding pads are arranged in pairs. Each of the bonding pads is frustum-shaped. The reflective layer is disposed between two adjacent pairs of the bonding pads. A material of the reflective layer includes photocuring reflective ink. Each of the light-emitting units is electrically connected to each pair of the bonding pads.