Display Panel Copper Power Line Layout for IR Drop Uniformity
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Solution Overview
Problem
The challenge of achieving high brightness uniformity in display panels is hindered by significant voltage drops in power lines due to IR drop, which existing methods using multiple metal layers struggle to address effectively.
Innovation Solution
A display panel design incorporating a resistance reduction layer with specific electrode and power line configurations, utilizing a thicker copper layer to reduce impedance and enhance voltage uniformity, allowing direct bonding with light-emitting devices without additional adhesion layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple metal layers are used to reduce voltage drop, then voltage uniformity is improved, but device complexity increases
Solution Approach 1:
The patent changes the material parameter by using a copper-based resistance reduction layer with thickness of 2-15 microns instead of conventional thin metal layers. This parameter change achieves low voltage uniformity (>85%) while maintaining a simplified single-layer structure, resolving the contradiction between reliability and device complexity
Solution Approach 2:
The patent employs a composite material approach by using copper-based materials with specific thickness in the resistance reduction layer, combining the benefits of high conductivity and structural simplicity. This composite material solution achieves both improved voltage uniformity and reduced device complexity compared to multiple thin metal layers
2Reliability
If additional adhesion layers are added to improve bonding, then bonding reliability is improved, but device complexity increases
Solution Approach 1:
The patent extracts and eliminates the adhesion layer from the conventional multi-layer structure. The copper-based resistance reduction layer with thickness 2-15 microns serves both as a conductive layer and as a bonding interface, directly bonding with light-emitting device electrodes without requiring additional adhesion layers, thus reducing device complexity while maintaining bonding reliability
Solution Approach 2:
The resistance reduction layer performs multiple functions: it provides electrical conductivity, serves as a bonding interface for light-emitting devices, and eliminates the need for separate adhesion layers. This multi-functionality resolves the contradiction by achieving bonding reliability without increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves voltage uniformity greater than 85%, improving brightness uniformity and simplifying the film layer structure and process by eliminating the need for additional adhesion layers, thereby enhancing display performance.
Implementation Method 1
utilizing a thicker copper layer to reduce impedance and enhance voltage uniformity
Implementation Method 2
the first electrode and the first power line are electrically connected to the transistors
Data Source
AI summary
The present application provides a display panel and a display device. The display panel includes a driver circuit layer, a resistance reduction layer, and a light emitting device. The driver circuit layer includes a plurality of transistors. A first electrode, a second electrode, and a first power line are formed on the resistance reduction layer. The first electrode and the first power line are electrically connected to transistors. A first electrode member of the light emitting device is bonded to the first electrode, and a second electrode member of the light emitting device is bonded to the second electrode. A voltage uniformity on the first power line is greater than 85%.