Display Panel Laser Cutting with Dummy Seal Striking

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Solution Overview

Problem

The existing methods for manufacturing display panels face challenges in reducing defects during the cutting process, particularly due to jagged cut surfaces and uneven separation of the margin area from the panel area, which can lead to product failures and reduced production efficiency.

Innovation Solution

A method involving a unit panel with a recessed zone and dummy seals, where a laser is used to cut along a trench line formed on both substrates, and the margin area is separated by striking the dummy seals, ensuring clean separation and minimizing chipping areas through uniform impact distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional cutting methods are used to separate the margin area from the panel area, then the cutting process is simple, but the cut surface becomes jagged and defects occur

Engineering Contradiction:
Improvecut surface qualityVSAvoidcutting process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by forming a recessed zone at the boundary between the panel area and margin area before the cutting process. This recessed zone serves as a pre-prepared separation line that guides the laser cutting process, ensuring that the cut follows a precise path and produces a smooth cut surface rather than a jagged one. The recessed zone is created during the sealing member formation process, before cutting occurs.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses dummy seals as intermediary elements placed within the recessed zone. These dummy seals act as mediators during the striking process, distributing the impact force uniformly along the cut line. When the margin area is struck to separate it from the panel area, the dummy seals ensure that the force is applied evenly, preventing jagged edges and producing a clean separation with minimal chipping.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If the margin area is struck to separate it from the panel area, then separation is achieved, but uneven impact distribution causes defects

Engineering Contradiction:
Improveseparation uniformityVSAvoidseparation process difficulty
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies local quality by placing dummy seals at specific locations within the recessed zone rather than distributing them uniformly across the entire margin area. The dummy seals are positioned at intervals along the cut line, with each dummy seal providing localized impact distribution at critical points. This localized approach ensures uniform impact distribution where it is most needed during the striking process, while simplifying the overall manufacturing process.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If chipping areas are minimized through precise cutting, then product quality improves, but production efficiency decreases

Engineering Contradiction:
Improvechipping area controlVSAvoidproduction efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces conventional mechanical cutting methods with laser cutting technology. The laser beam precisely follows the recessed zone boundary to create the separation line, eliminating the need for mechanical contact that would cause jagged edges and chipping. This substitution maintains high production efficiency while achieving superior cut surface quality with minimal chipping areas of 200 μm or less.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the length of chipping areas to 200 μm or less, with a 10 μm or less length difference between substrates, minimizing defects and improving production efficiency and product quality by ensuring a smooth, clean cut surface.

Implementation Method 1

cutting a line between the panel area and the margin area by irradiating a laser along a boundary of the panel area

Methodology Applied
Scientific EffectLaser: Laser

Implementation Method 2

irradiating a laser along a boundary of the panel area

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 3

striking a vicinity of the one or more dummy seals such that the margin area at an outer periphery of the cut line is separated from the panel area

Methodology Applied
Scientific EffectImpact force: Impact Force

Data Source

PatentUS10811629B2Display panel and manufacturing method thereof
Publication Date: 2020.10.20 SAMSUNG DISPLAY CO LTD
  • US10811629B2 patent drawing
  • US10811629B2 patent drawing
  • US10811629B2 patent drawing

AI summary

A display panel and a method of manufacturing a display panel are provided. A method of manufacturing a display panel includes: preparing a unit panel including a panel area having a display unit and a margin area arranged outside the panel area and including one or more dummy seals; cutting a line between the panel area and the margin area by irradiating a laser along a boundary of the panel area; and striking a vicinity of the one or more dummy seals such that the margin area at an outer periphery of the cut line is separated from the panel area.