Display Panel Lead Layout for Low-Damage Laser Etching

The laser etching process is divided into multiple sequential steps with different laser parameters. The first step uses lower power to create an initial groove, the second step continues etching with adjusted parameters, and the third step completes the thickness matching. This segmentation allows precise control of the etching depth while minimizing cumulative laser damage to the film layers and light-emitting devices.

Before completing the connecting lead formation, the method performs preliminary actions including forming a first groove, then a second groove, and finally a third groove in sequence. Each preliminary step prepares the structure for the next step, allowing the laser to gradually remove material with reduced energy concentration, thereby preventing sudden excessive heating and damage to sensitive components.

The laser etching process is segmented into three distinct steps, each with controlled laser power and duration. This segmentation prevents excessive energy concentration that would damage the driving circuit and light-emitting devices, while still achieving the required precision in connecting lead thickness. Each step contributes to the final precise shape without compromising component reliability.

The method applies partial laser etching actions in sequence rather than a single excessive action. Each laser step removes only the necessary amount of material for that stage, avoiding over-etching and thermal damage to sensitive components. The cumulative effect of partial actions achieves the target precision while preserving component integrity.