Display Panel Laser Transfer Manufacturing Narrow Bezel
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Solution Overview
Problem
Existing display panels have a significant non-display region that reduces the effective image display area, leading to a larger bezel width and less efficient use of display space.
Innovation Solution
A method for manufacturing a display panel that involves creating a base layer with exposed pads, forming a circuit film line using a laser beam, and disposing a transfer substrate to create a conductive pattern on the pads and circuit film line, thereby reducing the non-display region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If conventional manufacturing methods are used with larger non-display regions, then manufacturing process is simpler, but display area ratio is reduced
Solution Approach 1:
The manufacturing process is divided into multiple precise steps: forming openings in the base layer to expose pads, creating circuit film lines through laser etching, positioning transfer substrates with conductive patterns, and selective welding. This segmentation enables the reduction of non-display regions while maintaining manufacturing feasibility through systematic process breakdown
Solution Approach 2:
Laser technology replaces conventional mechanical etching and alignment methods. Laser beams are used for precise etching of circuit film lines and for positioning conductive patterns through laser-induced transfer, achieving higher precision and smaller feature sizes that enable reduced non-display regions
2Area of moving object
If non-display region is reduced to increase display area, then display quality is improved, but manufacturing precision requirement increases
Solution Approach 1:
A transfer substrate is introduced as an intermediary element that carries pre-formed conductive patterns. This transfer substrate acts as a mediator between the circuit film layer and the final display structure, enabling precise positioning of conductive patterns through laser-induced transfer without requiring direct high-precision alignment of all components
Solution Approach 2:
Conductive patterns are pre-formed on the transfer substrate before the final assembly process. This preliminary action allows the conductive patterns to be prepared with high precision in advance, and then transferred to the final position with reduced alignment requirements during assembly
3Length of stationary object
If non-display region is reduced, then bezel width is narrowed, but device complexity increases
Solution Approach 1:
The patent employs laser parameters (wavelength, power, pulse duration) as controllable variables to achieve precise material removal and pattern formation. By adjusting laser parameters, the process can be optimized for different materials and feature sizes, enabling narrow bezel widths through precise control of etching depth and pattern dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces the non-display region, increasing the display area ratio and resulting in a display device with a narrower bezel width, thereby enhancing display quality and efficiency.
Implementation Method 1
forming a circuit film line from the preliminary circuit film line by irradiating a laser beam to the circuit film
Implementation Method 2
transferring a portion of the donor film through the first laser beam irradiated toward the transparent substrate
Implementation Method 3
irradiating a second laser beam to a region in which a film line overlaps the conductive pattern, and the second laser beam may weld the circuit film line to the conductive pattern
Data Source
AI summary
A method for manufacturing a display panel includes: preparing for a base layer including a pad inside the base layer, forming an opening such that the pad are exposed by etching a portion of the base layer, preparing for a circuit film having a preliminary circuit film line provided in the circuit film, forming a circuit film line from the preliminary circuit film line by irradiating a laser beam to the circuit film, disposing the base layer and the circuit film such that the pad and the circuit film line overlap each other on a stage, and disposing a transfer substrate on the base layer, and forming a conductive pattern on the pad and the circuit film line, where the forming of the conductive pattern includes irradiating a first laser beam on the transfer substrate.