Dual-Sided Display Panel Layout for Pre-Tested Micro-LED Integration
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Solution Overview
Problem
The challenge of effectively integrating micro-LEDs with liquid crystal panels remains unresolved, particularly in terms of efficient production yield and circuit layout optimization.
Innovation Solution
A display panel design featuring a first substrate with circuit structures on both surfaces, allowing pre-bonding LED testing and flexible circuit board bending for improved alignment and reduced complexity, along with separate circuit structures for liquid crystal and LED control, enhancing production yield and reducing circuit interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the LED is directly bonded to the circuit structure on the first substrate, then the bonding process is simplified, but testing and repairing of the LED becomes difficult and production yield decreases
Solution Approach 1:
The invention separates the LED module from the main substrate by introducing a flexible circuit board as an intermediate carrier. The LED is first bonded to the flexible circuit board, which can then be detached for testing and repair before final integration with the first substrate. This segmentation allows independent handling of the LED assembly, resolving the contradiction between simplified bonding and ease of repair.
Solution Approach 2:
The flexible circuit board serves as an intermediary component between the LED and the first substrate. It enables the LED to be tested and repaired independently before final bonding, while still allowing for simplified overall assembly. The intermediary structure resolves the contradiction by providing a detachable testing interface without complicating the final bonded structure.
2Productivity
If the LED is directly bonded to the circuit structure on the first substrate, then the assembly process is streamlined, but production yield decreases due to inability to pre-test LEDs
Solution Approach 1:
The invention enables preliminary testing of LEDs on the flexible circuit board before final assembly with the first substrate. This preliminary action allows defective LEDs to be identified and replaced early in the process, improving production yield. The flexible circuit board facilitates this preliminary testing without significantly complicating the overall assembly process, thus resolving the contradiction between assembly efficiency and production yield.
3Device complexity
If circuit structures for liquid crystal and LED control are integrated, then device complexity is reduced, but circuit interference increases and performance deteriorates
Solution Approach 1:
The invention physically separates the liquid crystal control circuit (on the first substrate) from the LED control circuit (on the flexible circuit board). This segmentation eliminates circuit interference between the two systems while maintaining manageable device complexity through modular design. Each circuit operates independently on its own substrate, resolving the contradiction between integration and interference.
Solution Approach 2:
The LED control circuit is extracted from the first substrate and placed on a separate flexible circuit board. This extraction removes potential sources of circuit interference while keeping the overall device complexity controlled through the use of a standardized flexible circuit board interface. The separation allows independent optimization of each circuit system.
Data Source
AI summary
A display panel includes a first substrate, a first circuit structure, a second circuit structure, a liquid crystal layer, a light-emitting diode module (LED module), a sealant layer and a second substrate. The first circuit structure and the second circuit structure are respectively disposed on the first surface and the second surface of the first substrate. The liquid crystal layer is located on the first circuit structure. The LED module includes a flexible circuit board and a light-emitting diode (LED). The flexible circuit board is connected to the second circuit structure and is bent from the second surface of the first substrate to above the first surface of the first substrate. The LED is disposed on the flexible circuit board located over the first surface of the first substrate. The sealant layer surrounds the liquid crystal layer and covers the LED.