Display Panel Motherboard Packaging Patterns for Deformation Control
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Solution Overview
Problem
Conventional OLED display panels experience deformation and interference fringes (Newton rings) due to low-pressure blank regions between adjacent display areas, affecting display quality and causing cutting issues during panel manufacturing.
Innovation Solution
The display panel motherboard design includes first and second substrates with specific packaging material patterns and heat dissipating layers, ensuring no deformation under atmospheric pressure and maintaining panel toughness by maintaining the non-display region area, thus eliminating Newton rings and avoiding cutting-related crushing problems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If packaging material patterns are added to eliminate low-pressure blank regions, then Newton rings and deformation are reduced, but manufacturing complexity increases
Solution Approach 1:
The packaging material is segmented into multiple patterns (first packaging material pattern and second packaging material pattern) positioned at different locations on the substrate. This segmentation allows the packaging material to fill multiple low-pressure blank regions simultaneously, eliminating Newton rings and deformation while maintaining a manageable manufacturing process through systematic pattern placement rather than a single complex structure.
2Stability of the object's composition
If packaging material patterns are positioned close to display regions, then deformation is minimized, but cutting difficulty increases
Solution Approach 1:
The packaging material patterns are strategically positioned at specific locations on the substrate, with the second packaging material pattern located at a first position and the first packaging material pattern located at a second position. This local quality approach allows the packaging material to be placed close to display regions to minimize deformation while maintaining sufficient distance from cutting paths to avoid interference with the cutting process, thus balancing panel stability with manufacturing ease.
3Strength
If multiple packaging material patterns are used, then panel toughness is maintained during cutting, but manufacturing steps increase
Solution Approach 1:
The first packaging material pattern and second packaging material pattern are integrated into a unified packaging structure on the substrate. This merging of packaging material patterns into a coordinated system allows them to work together to maintain panel toughness during cutting while distributing the manufacturing complexity across a systematic process rather than requiring separate independent steps for each packaging element.
Data Source
AI summary
The present disclosure discloses a display panel motherboard, a method of manufacturing a display panel, and a display apparatus. The display panel motherboard includes a first substrate and a second substrate provided opposite to each other. The first substrate has a plurality of first zones and a plurality of second regions, each of the plurality of first zones has a first display region and a first packaging material pattern on a periphery of the first display region, each of the plurality of second zones has a second packaging material pattern, and the second packaging material pattern is at at least one side of the first packaging material pattern facing away from the first display region.