Display Panel Offset Cutting to Prevent Substrate Separation

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Solution Overview

Problem

During the cutting process of display panels, the second substrate may become slightly larger than the first substrate due to cutting accuracy issues, leading to separation and damage when the panel is assembled, as the second substrate collides with the mold frame.

Innovation Solution

A cutting method where the cutter on the second substrate side is aligned closer to the display area than the cutter on the first substrate side, with a controlled inward retraction to ensure the second substrate does not exceed the first substrate, preventing separation and damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If cutters on both substrate sides are aligned on the same straight line, then cutting precision is improved, but the second substrate becomes larger than the first substrate due to cutting accuracy, causing collision and separation during assembly

Engineering Contradiction:
Improvecutting alignment precisionVSAvoidsubstrate assembly stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies asymmetry by intentionally misaligning the cutters on the first and second substrate sides. Instead of positioning both cutters on the same straight line, the cutter on the second substrate side is positioned closer to the display area than the cutter on the first substrate side. This asymmetric arrangement compensates for cutting accuracy variations, ensuring that the first substrate extends beyond the second substrate at the non-binding area, preventing collision and separation during assembly while maintaining overall cutting precision.

Inventive Principle:
Principle #4Asymmetry

2Reliability

If the cutter on the second substrate side is positioned closer to the display area, then substrate collision is prevented, but cutting complexity increases due to differential cutter positioning

Engineering Contradiction:
Improvesubstrate assembly stabilityVSAvoidcutter alignment complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-establishing asymmetric alignment marks on the first and second substrates before the cutting process. These alignment marks are positioned at different locations relative to the display area, allowing the cutters to be independently positioned according to their respective marks. This preliminary preparation simplifies the actual cutting operation by providing clear positioning references, reducing the complexity of differential cutter positioning while ensuring the cutter on the second substrate side is correctly positioned closer to the display area.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12447732B2Method for offset cutting of display panel substrates to prevent separation of substrates upon placement, display panel, and display device
Publication Date: 2025.10.21 CHUZHOU HKC OPTOELECTRONICS TECH CO LTD
  • US12447732B2 patent drawing
  • US12447732B2 patent drawing
  • US12447732B2 patent drawing

AI summary

The present application discloses a cutting method for a display panel, a display panel and a display device, the cutting method for a display panel including a cutting stage of a side edge of a binding area and a cutting stage of a side edge of a non-binding area, the cutting stage of a side edge of a non-binding area includes steps of: aligning a cutter according to an alignment mark preset on the side edge of the non-binding area on the display panel, so that a cutter on a second substrate side is closer to a display area of the display panel than a cutter on a first substrate side, and cutting the first substrate and the second substrate by the cutter on the second substrate side and the cutter on the first substrate side respectively.