Display Panel Pad Arrangement for Adhesive Fluidity

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Solution Overview

Problem

Existing display technologies face challenges in achieving stable bonding between conductive pads and bumpers, particularly in high-resolution displays where fine alignment and adhesive flow are compromised due to the arrangement of conductive pads and bumpers, leading to issues with compression bonding and fluidity of the adhesive layer.

Innovation Solution

The arrangement of conductive pads and bumpers in a display panel and chip on film, where the distance between pad rows and bumper rows increases from the center to the lateral end portions, with varying lengths and non-aligned configurations, enhances the fluidity of the adhesive layer and improves the stability of bonding between conductive pads and bumpers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conductive pads and bumpers are arranged in a conventional aligned configuration, then alignment precision is improved, but adhesive layer fluidity deteriorates and bonding stability worsens

Engineering Contradiction:
Improvealignment precisionVSAvoidbonding stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies asymmetry by intentionally misaligning the conductive pads and bumpers, creating an asymmetric configuration where the pads and bumpers do not directly correspond to each other. This asymmetric arrangement prevents the adhesive from being blocked by direct alignment, allowing it to flow properly and form stable bonding, thereby resolving the contradiction between alignment precision and bonding stability.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent applies local quality by varying the distances between adjacent pads and bumpers in different regions. Specifically, the distance between a pad and its adjacent bumpers is designed to be different from the distance to other adjacent bumpers. This local variation in spacing creates optimal conditions for adhesive flow in different areas, improving overall bonding stability while maintaining manufacturing precision.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If conductive pads are arranged with uniform spacing, then manufacturing simplicity is improved, but adhesive layer fluidity deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidadhesive layer fluidity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies local quality by implementing non-uniform spacing between conductive pads and bumpers. The distance between a pad and its adjacent bumpers is deliberately designed to differ from distances to other bumpers, creating locally optimized spacing that enhances adhesive fluidity. This approach maintains ease of manufacture through systematic design while significantly improving adhesive layer fluidity and bonding reliability.

Inventive Principle:
Principle #3Local quality

3Strength

If compression bonding pressure is increased to improve bonding stability, then bonding strength is improved, but the risk of misalignment and adhesive layer defects increases

Engineering Contradiction:
Improvebonding strengthVSAvoidalignment precision
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent applies asymmetry by misaligning pads and bumpers, which creates asymmetric stress distribution during compression bonding. This asymmetric configuration allows the adhesive to flow into the gaps and distribute pressure more evenly, achieving strong bonding without requiring excessive compression pressure, thereby preventing alignment issues and adhesive defects.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent uses the misaligned configuration as an intermediary mechanism that facilitates adhesive flow and pressure distribution. The intentional offset between pads and bumpers acts as a mediator that enables the adhesive to properly fill the bonding interface, achieving strong bonding strength while maintaining alignment precision and preventing bonding defects.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS9064708B2Display panel, chip on film and display device including the same
Publication Date: 2015.06.23 SAMSUNG DISPLAY CO LTD
  • US9064708B2 patent drawing
  • US9064708B2 patent drawing
  • US9064708B2 patent drawing

AI summary

A display panel includes a display area including a display element, and a non-display area adjacent to the display area, the non-display area including a plurality of conductive pads. The conductive pads are spaced apart at a predetermined distance so as to form a first pad row and a second pad row, the conductive pads collectively having a center portion and lateral portions. A distance between the first pad row and the second pad row is greater at at least one of the lateral end portions than at the center portion.