Display Panel PCB Bonding on Inclined Pad Surfaces
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Solution Overview
Problem
Existing bonding methods for display devices face challenges in efficiently and accurately bonding printed circuit boards to display panels, particularly when dealing with inclined surfaces, which can lead to misalignment and reduced bonding quality.
Innovation Solution
A method and apparatus that utilize a stage with rotational and vertical movement capabilities, combined with sensors and camera systems, to align and bond pads on the printed circuit board with those on the display panel, using ultrasonic bonding or anisotropic conductive films, ensuring precise alignment and secure bonding even on inclined surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding methods are used on inclined surfaces, then bonding can be performed, but misalignment occurs and bonding quality deteriorates
Solution Approach 1:
The bonding apparatus incorporates a stage with rotational and tilting capabilities that can dynamically adjust its orientation. The stage rotates about a first axis and tilts about a second axis, allowing the bonding head to approach the display panel from different angles. This dynamic positioning enables precise alignment of bonding pads even when the display panel has inclined surfaces, resolving the contradiction between maintaining alignment precision and accommodating variable surface geometries.
Solution Approach 2:
The system changes the bonding approach angle as a variable parameter. By controlling the stage's rotational and tilting angles, the bonding head can approach the display panel at optimized angles that compensate for surface inclination. This parameter adjustment allows the bonding process to maintain high precision on inclined surfaces without compromising bonding quality.
2Manufacturing precision
If the bonding apparatus is designed with complex rotational and vertical movement capabilities, then alignment precision on inclined surfaces is improved, but device complexity increases
Solution Approach 1:
The stage serves multiple functions: it holds the display panel, provides rotational movement about a first axis, provides tilting movement about a second axis, and enables vertical movement of the bonding head. By consolidating these diverse movements into a single multi-functional stage structure, the apparatus achieves high alignment precision without proportionally increasing overall device complexity.
Solution Approach 2:
The patent employs sensors to detect the position and orientation of the display panel, replacing complex mechanical measurement systems. The control unit processes sensor data to automatically calculate and adjust the stage's rotational and tilting angles, substituting automated control logic for manual mechanical alignment procedures.
3Manufacturing precision
If manual alignment methods are used, then device complexity is low, but alignment precision and bonding quality deteriorate
Solution Approach 1:
The system incorporates sensors that detect the actual position and orientation of the display panel during the bonding process. This feedback information is transmitted to the control unit, which automatically adjusts the stage's rotational and tilting angles to compensate for deviations. This closed-loop feedback mechanism ensures high pad alignment precision without requiring overly complex manual alignment procedures.
Solution Approach 2:
The bonding apparatus performs self-alignment by using its own sensors to detect panel orientation and automatically adjusting its stage position accordingly. The system serves its own alignment needs without requiring external intervention or complex external alignment equipment, achieving high precision while controlling device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy and precise bonding of printed circuit boards to display panels, improving the reliability and efficiency of the bonding process by accommodating inclined surfaces and ensuring proper alignment, thus enhancing the overall performance and durability of the display device.
Implementation Method 1
The bonding of the first and second pads is performed by an ultrasonic bonding method
Implementation Method 2
an anisotropic conductive film (ACF) bonding method
Data Source
AI summary
A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.