Flexible Display Panel Substrate Cutting and Polarizer Attachment

The method applies preliminary action by performing the cutting operation before the substrate is fully assembled with all components. By cutting the substrate while it is still in a less constrained state, the flexible substrate experiences reduced stress and minimal shrinkage or warping during the cutting process, thereby maintaining manufacturing precision while preserving flexibility.

The cutting operation is performed as a preliminary step before final assembly and bonding. By exposing the bonding pads through cutting earlier in the manufacturing process, the substrate can be separated and positioned more easily, avoiding the difficulties that would arise from attempting to cut and separate flexible substrates after full assembly.

The manufacturing method merges multiple operations into a more efficient sequence: polarizers are attached to the substrate, then cutting is performed, and finally bonding pads are exposed. This combined approach actually reduces overall process complexity compared to performing these operations separately, as it prevents film shrinkage and warping that would require additional corrective steps, thereby maintaining surface flatness while streamlining the manufacturing process.