Display Panel Insulating Structure Recessed Pad Design
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Solution Overview
Problem
Existing display panel manufacturing techniques face challenges in enhancing structural integrity and reliability of electrical connections between circuit boards and signal lines, particularly in reducing the bezel area while maintaining effective contact resistance.
Innovation Solution
A display panel design featuring a first and second base substrate, an insulating structure with organic and inorganic layers, and a connection pad that overlaps the signal line, allowing for improved electrical connection characteristics by exposing the signal line end and using plasma gas etching to form stepped or recessed pad portions for enhanced contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the insulating structure extends to the side surface of the second base substrate, then the structural integrity is improved, but the contact area between the connection pad and signal line is reduced
Solution Approach 1:
The insulating structure is designed with different extension patterns: the non-pad portion extends to the side surface to provide structural support, while the pad portion is recessed to create adequate contact area. This local differentiation allows each region to fulfill its specific function optimally.
Solution Approach 2:
The insulating structure is divided into functionally distinct non-pad and pad portions with different geometries. The non-pad portion provides structural integrity by extending to the side surface, while the pad portion creates a recessed area for electrical contact, segmenting the insulating structure to resolve the contradiction between structural support and electrical connection.
2Reliability
If the connection pad is positioned to maximize contact with the signal line, then the electrical connection reliability is improved, but the bezel area increases
Solution Approach 1:
The connection pad is positioned in the vertical dimension by creating a recessed pad portion that extends downward from the insulating structure. This allows the connection pad to contact the signal line at a lower level, effectively utilizing the third dimension (depth) rather than expanding the horizontal bezel area.
Solution Approach 2:
The connection pad structure is nested within the recessed portion of the insulating structure. The pad portion is embedded in the insulating material, creating a stepped configuration where the connection pad sits in a recessed area, maximizing contact area without increasing the overall footprint of the display panel.
3Reliability
If the insulating structure is made thicker to improve insulation, then the electrical insulation is improved, but the manufacturing complexity increases
Solution Approach 1:
The insulating structure is segmented into multiple organic layers with different thicknesses and compositions. This layering approach provides adequate electrical insulation while allowing each layer to be optimized for specific functions, reducing the need for a uniformly thick insulating structure that would increase manufacturing complexity.
Solution Approach 2:
The insulating structure comprises multiple organic layers with different material compositions and properties. This composite structure achieves the required electrical insulation through material selection and layer configuration rather than simply increasing overall thickness, thereby managing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the structural integrity and reliability of electrical connections, reduces the bezel area, and minimizes contact resistance between the circuit board and the display panel, thereby improving the overall manufacturing process and device performance.
Implementation Method 1
using plasma gas etching to form stepped or recessed pad portions for enhanced contact
Data Source
AI summary
A display panel includes a first base substrate, a second base substrate facing the first base substrate, an insulating structure including a non-pad portion having an end aligned with a side surface of the second base substrate and a pad portion having an end laterally recessed from the side surface of the second base substrate, a pixel overlapping a display area and disposed between the first and second base substrates, a signal line on the first base substrate and connected to the pixel, and a connection pad including a portion disposed in a connection region defined between the side surface of the second base substrate and the end of the pad portion. The signal line overlaps the pad portion. The connection pad is in contact with the signal line. The insulating structure is disposed between the first and second base substrates and overlaps a non-display area outside the display area.