Display Panel Lower Member with Region-Specific Adhesion
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Solution Overview
Problem
Existing electronic devices face challenges in achieving reduced thickness and improved manufacturing efficiency while integrating electronic modules such as cameras and sensors due to the complexity of multiple layers required for supporting, heat dissipation, and optical signal transmission.
Innovation Solution
The implementation of a lower member with an adhesive layer and a functional layer containing fillers, where the adhesive strength varies between regions to facilitate easier assembly and integration of electronic modules, supported by a single functional layer that performs multiple functions including support, heat dissipation, and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple layers are used for supporting, heat dissipation, and optical signal transmission, then the structural support and heat dissipation performance are improved, but the overall thickness of the electronic device increases
Solution Approach 1:
The patent combines multiple functional layers (support layer, heat dissipation layer, optical signal transmission layer) into a single integrated lower member structure. This merging of functions into one component achieves the required thermal and structural performance without increasing the overall device thickness through multiple stacked layers.
Solution Approach 2:
The lower member is designed as a multi-functional component that simultaneously provides structural support, heat dissipation, and optical signal transmission capabilities. This universal design allows a single layer to perform multiple functions that would traditionally require separate layers, thereby reducing overall device thickness.
2Adaptability or versatility
If multiple layers with different functions are integrated, then the functional performance is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges multiple functional layers into a single lower member that can be manufactured as one integrated component. This reduces the number of assembly steps and manufacturing processes required, thereby simplifying production while maintaining all necessary functions including support, heat dissipation, and optical signal transmission.
Solution Approach 2:
By designing a universal lower member that performs multiple functions simultaneously, the patent eliminates the need to manufacture and assemble separate layers for each function. This multi-functional approach reduces manufacturing process complexity while achieving comprehensive functional performance.
3Ease of manufacture
If uniform adhesive strength is used across the entire adhesive layer, then the manufacturing process is simplified, but the ease of assembly and integration of electronic modules is reduced
Solution Approach 1:
The adhesive layer is designed with spatially varying adhesive strength, where different regions have different adhesive properties tailored to their specific functions. This local differentiation allows for easier assembly in certain areas while maintaining strong bonding where needed, achieving both manufacturing simplicity and assembly ease through region-specific optimization.
Data Source
AI summary
An electronic device includes an electronic module which provides a function to the electronic device, a display panel comprising a first region, and a second region which is adjacent to the first region and corresponds to the electronic module, and a lower member below the display panel. The lower member includes an adhesive layer including a first adhesive portion which corresponds to the first region of the display panel and has an adhesive strength, and a second adhesive portion which corresponds to the second region of the display panel and has an adhesive strength lower than that of the first adhesive portion, together with a functional layer which is directly below the first adhesive portion and includes a plurality of fillers which are in a base layer and have an average diameter of about 10 micrometers to about 70 micrometers.