Display Panel Repair Layout for Dense Signal Line Faults
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Solution Overview
Problem
The challenge of short circuits and open circuits in high-resolution display panels due to densely disposed signal lines necessitates an effective repair process to improve yield and reduce challenges.
Innovation Solution
A display panel design with a substrate having bonding and repair pads, data and repair signal lines, and an isolation layer, along with a method involving detection, cutting, and welding processes to repair signal lines, ensuring electrical connections through transfer lines and repair signal lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If signal lines are disposed densely to achieve high resolution, then display resolution is improved, but short circuits between adjacent signal lines occur more frequently
Solution Approach 1:
The signal transmission path is segmented into multiple independent components: data lines, transfer lines, and repair signal lines. This segmentation allows for localized repair of specific line segments without affecting the entire display panel, thereby maintaining high resolution while improving reliability through modular fault isolation and repair capability.
Solution Approach 2:
Repair signal lines and transfer lines are pre-configured during manufacturing before any faults occur. The transfer lines are positioned to cross over data lines in advance, and repair signal lines are routed to accessible repair pads. This preliminary preparation enables rapid repair response when short circuits occur, reducing downtime while maintaining the dense signal line configuration for high resolution.
2Reliability
If repair processes are implemented to fix short-circuited signal lines, then signal line reliability is improved, but manufacturing complexity increases
Solution Approach 1:
Transfer lines serve as intermediary conductors that bridge between data lines and repair signal lines. When a short circuit is detected, the repair process uses transfer lines as intermediate connection points to reroute signals around damaged segments. This intermediary approach simplifies the repair process by providing pre-established connection paths, reducing the complexity of implementing repairs in high-resolution displays.
Solution Approach 2:
The repair functionality is extracted as a separate, dedicated subsystem with its own signal lines and pads, independent from the main data transmission paths. This extraction allows repair operations to be performed without interfering with normal display operations, and enables specialized repair tools and processes to be developed independently, thereby managing overall system complexity.
3Ease of repair
If repair signal lines are added to enable signal line repair, then ease of repair is improved, but device complexity increases
Solution Approach 1:
Repair signal lines are merged with the existing data line infrastructure by using the same routing layers and sharing common structures where possible. Transfer lines are integrated into the existing pixel electrode structures, combining multiple functions (signal transmission and repair routing) within unified structural elements. This merging approach improves repairability while minimizing the increase in overall device complexity.
Solution Approach 2:
Transfer lines are designed with multi-functionality, serving both as normal signal transmission paths during operation and as intermediate connection points during repair operations. The same physical structures perform multiple roles, reducing the need for separate dedicated repair infrastructure and thereby improving ease of repair without proportionally increasing device complexity.
Data Source
AI summary
Disclosed is a display panel including a substrate, multiple first bonding pads, multiple repair pads, a pixel array, multiple first data lines, multiple transfer lines, multiple repair signal lines, and an isolation layer. The substrate has a bonding pad area, a repair area, and a pixel array area. The repair area is located between the bonding pad area and the pixel array area. The first data lines extend from the bonding pad area to the pixel array area, and the first data lines electrically connect the first bonding pads to the pixel array respectively. The transfer lines are located over the repair area and across the first data lines. The repair signal lines extend from the bonding pad area to the repair area and are electrically connected to the repair pads respectively. The isolation layer is located between the transfer lines and the repair signal lines.