Display Panel Thermal Layout With Rib-Isolated Circuit Board

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Solution Overview

Problem

Display devices experience uneven temperature distribution due to electronic elements and wirings on the panel, leading to degraded image quality and color inconsistencies.

Innovation Solution

A display device design featuring a cover bottom and plate bottom made of metallic materials with higher thermal conductivity, along with a radiant heat structure and air gaps to minimize temperature differences, and a flexible film connecting the display panel to a circuit board with ribs or pegs to separate the circuit board from the panel, enhancing heat dissipation and uniform temperature distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electronic elements and wirings are disposed on the display panel, then the display device can be driven, but the temperature distribution becomes uneven leading to degraded image quality

Engineering Contradiction:
Improvedriving capabilityVSAvoidtemperature uniformity
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

A heat dissipation structure is introduced as an intermediary component between the electronic elements and the display panel. This heat dissipation structure includes a heat dissipation member in contact with the rear surface of the display panel and a heat radiation member extending from the heat dissipation member to radiate heat to the external environment, thereby mediating the heat transfer process and maintaining temperature uniformity across the display panel.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Stability of the object's composition

If the center of the display panel has lower heat radiation than the edge, then the panel structure is maintained, but the temperature is relatively higher in the center than the edge

Engineering Contradiction:
Improvepanel structureVSAvoidtemperature distribution uniformity
Core Design Contradiction:
Stability of the object's compositionVSTemperature

Solution Approach 1:

The heat radiation member is designed with varying thickness or extended structures at different locations of the display panel. Specifically, the heat radiation member may have greater extension or surface area at the center region where heat accumulation is more severe, creating local quality differences in heat radiation capability to compensate for the structural constraint and achieve uniform temperature distribution.

Inventive Principle:
Principle #3Local quality

3Temperature

If a heat dissipation structure is added to the display panel, then temperature uniformity is improved, but the device complexity increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation structure is merged with the existing backlight unit or housing structure of the display device. The heat dissipation member and heat radiation member are integrated into components that already exist in the display device architecture, such as combining the heat radiation member with the backlight housing or structural frame, thereby achieving heat dissipation functionality without proportionally increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves image quality by reducing temperature differences across the display panel, minimizing heat influence from the circuit board, and extending the panel's lifespan, while also enabling low-power driving and reducing production energy consumption.

Implementation Method 1

a plate bottom disposed to be in contact with the display panel at an opening of the cover bottom

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

at least one rib disposed between the plate bottom and the circuit board, wherein the circuit board is spaced apart from the plate bottom by the rib

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

a flexible film configured to connect the display panel and the circuit board through the opening

Methodology Applied
Scientific EffectAir gap thermal resistance: Thermal Insulation

Data Source

PatentUS20240363597A1Display Device
Publication Date: 2024.10.31 LG DISPLAY CO LTD
  • US20240363597A1 patent drawing
  • US20240363597A1 patent drawing
  • US20240363597A1 patent drawing

AI summary

A display device includes a display panel; a cover bottom disposed on a rear surface of the display panel; a plate bottom disposed to be in contact with the display panel at an opening of the cover bottom; a circuit board; a flexible film configured to connect the display panel and the circuit board through the opening; and at least one rib disposed between the plate bottom and the circuit board, wherein the circuit board is spaced apart from the plate bottom by the rib.