Display Panel Multilayer Signal Routing for Narrow Optical Frames

The patent applies dimensionality change by routing signal lines through different layers (first layer and second layer) to connect display regions across optical component regions. Instead of expanding the non-display region width in the planar dimension, the wiring transitions to the vertical dimension by using multiple stacked layers, allowing signal lines to pass underneath optical component regions without increasing the frame width.

The patent implements nesting by placing signal lines from different layers in a stacked configuration where first signal lines and second signal lines are positioned at different heights (different layers) but occupy the same horizontal space. This nested arrangement allows multiple wiring paths to coexist in a compact vertical stack, enabling reliable connections without expanding the lateral footprint of the non-display region.

The patent resolves wiring complexity by transitioning from two-dimensional planar routing to three-dimensional multi-layer routing. Signal lines are distributed across multiple stacked layers, allowing them to pass under optical component regions without requiring wide frame spaces. This vertical dimension utilization simplifies the routing path and reduces wiring complexity while maintaining narrow frame widths.

The patent applies segmentation by dividing the wiring system into multiple independent layers, where each layer contains specific signal lines. This segmentation allows different signal lines to be routed independently on different layers, making the overall wiring system more manageable and less complex, while enabling compact frame design with high screen ratio.

The patent addresses manufacturing complexity by systematically organizing signal lines across multiple layers with defined vertical stacking relationships. The multi-layer structure, while adding vertical complexity, actually simplifies manufacturing by allowing standard thin-film deposition and etching processes to be applied sequentially, creating a scalable fabrication approach that reduces overall device dimensions.

The patent implements multi-functionality by using the same multi-layer wiring architecture to simultaneously achieve multiple objectives: reducing frame width, maintaining connection reliability, enabling narrow frame design, and supporting various signal routing configurations. This universal structural approach simplifies manufacturing by providing a standardized platform that addresses multiple design requirements through a single architectural solution.