Display Panel Routing for Narrow Bezel via Layer Stacking
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Solution Overview
Problem
Existing display panels face challenges in reducing the occupation space of non-display regions to improve the screen occupation ratio, as metal routings in these areas require intervals to prevent short circuits, which occupy valuable space.
Innovation Solution
The display panel design positions metal routings in non-display regions on different layers of insulating layers, eliminating the need for horizontal intervals between them and allowing for closer placement, and incorporates a fan-out routing system that enables direct bending of the panel for COP packaging, reducing the space occupied by non-display regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal routings are disposed on the same insulating layer to prevent short circuit, then reliability is improved, but the occupation space of non-display region increases, reducing screen occupation ratio
Solution Approach 1:
The patent applies dimensionality change by transitioning metal routings from a two-dimensional plane arrangement to a three-dimensional stacked arrangement across multiple insulating layers. Specifically, adjacent metal routings are positioned on different insulating layers (first, second, and third insulating layers) with corresponding via holes penetrating through the layers to establish vertical electrical connections. This spatial reconfiguration eliminates the need for horizontal spacing between adjacent routings, thereby reducing non-display region occupation while maintaining electrical isolation and preventing short circuits.
2Reliability
If intervals are maintained between adjacent metal routings on the same layer, then short circuit is prevented, but the space occupied by routing structure increases
Solution Approach 1:
The patent resolves this contradiction by moving the isolation mechanism from the horizontal dimension to the vertical dimension. Instead of maintaining horizontal intervals between adjacent metal routings on the same layer, the invention stacks metal routings on different insulating layers and uses via holes for vertical connections. This approach eliminates horizontal spacing requirements while maintaining electrical isolation through layer separation, thereby reducing the overall space occupied by the routing structure.
Solution Approach 2:
The patent employs nesting by embedding via holes within the stacked insulating layer structure to establish vertical connections between metal routings on different layers. The via holes are precisely positioned and filled with conductive material, creating a nested configuration where connection pathways are integrated within the layered structure itself. This nesting approach enables compact routing without requiring additional horizontal space for connection paths.
3Area of stationary object
If metal routings are positioned closer together, then screen occupation ratio is improved, but transmission impedance increases
Solution Approach 1:
The patent addresses transmission impedance by transitioning to vertical stacking, which allows adjacent metal routings to be positioned closer horizontally without increasing impedance. The vertical separation through insulating layers provides effective electrical isolation, preventing crosstalk and impedance issues that would arise from close horizontal spacing. This dimensional change enables compact routing arrangements while maintaining signal integrity.
Data Source
AI summary
The present disclosure discloses a display panel which includes a substrate and plurality of insulating layers disposed on the substrate, and a plurality of metal routings, and includes a display region and a first non-display region at left and right sides of the display region, and a display, the plurality of metal routings being at the first non-display region and insulated from each other, and at least adjacent two of the metal routings being positioned on different layers of the insulating layers. An interval between adjacent metal routings on different insulating layers in a horizontal direction can be reduced through the above wiring manner, thereby reducing a space occupied by the first non-display region.