Display Panel Scribe Marks for Crack Prevention
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Solution Overview
Problem
Conventional methods for manufacturing flat display panels, especially those using thin glass substrates, suffer from low manufacturing efficiency due to chip and crack formation during the scribing process, which reduces production efficiency.
Innovation Solution
The implementation of a display panel design where the surfaces of the substrates are made flat and smooth, with a flattening film covering the periphery, and the use of scribe marks formed from the same conductive material as the thinnest conductive members, which are separated from the edges and designed to minimize stress and contact with the substrate, thereby reducing the likelihood of cracks and chips during the scribing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional scribing method is used to divide cells on large-size mother glass substrate, then production efficiency is improved, but chips and cracks are formed in the glass substrate reducing efficiency percentage
Solution Approach 1:
The patent applies preliminary action by forming scribe marks on the substrate before the actual scribing process. These pre-formed marks serve as guides and stress relief points that prevent crack propagation during subsequent cutting operations, thereby maintaining both high productivity and reliability
Solution Approach 2:
The patent introduces scribe marks as an intermediary element between the substrate and the scribing tool. These marks act as a mediator that controls stress distribution and prevents direct transmission of cutting forces that would cause chips and cracks, enabling efficient production without compromising substrate integrity
2Length of moving object
If glass substrate thickness is reduced to thin glass substrates (0.5 mm or smaller), then flat display panel thinning is achieved, but chip and crack formation during scribing increases significantly
Solution Approach 1:
The patent forms scribe marks on thin glass substrates before scribing to preemptively create stress relief pathways. This preliminary action is particularly critical for thin substrates (0.5 mm or smaller) as it prevents the propagation of cracks that would otherwise easily form and spread in the reduced thickness material
Solution Approach 2:
The patent changes the physical parameters of the substrate surface by creating controlled scribe marks with specific depth and geometry. This parameter modification allows thin glass substrates to withstand the scribing process without chip and crack formation, enabling panel thinning while maintaining manufacturing reliability
Data Source
AI summary
A liquid crystal display panel includes an active matrix substrate, a counter substrate, a liquid crystal layer, and a sealant. The counter electrode is opposed to the active matrix substrate. The liquid crystal layer is provided between the active matrix substrate and the counter substrate. The sealant, which surrounds the liquid crystal layer between the active matrix substrate and the counter substrate, joins the active matrix substrate and the counter substrate and seals the liquid crystal layer. A portion of the surface on the liquid crystal layer side of the active matrix substrate which is located at the periphery of the liquid crystal display panel is flat.