Display Panel Side Reflective Layer for Narrow Tiled Seams
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Solution Overview
Problem
The challenge in display technology is the large tiled seams between mini/micro LED display devices, which result in light leakage and affect the display effect due to the tapering of the front encapsulating film during laser cutting, leading to visible seams and reduced alignment accuracy.
Innovation Solution
A display panel design featuring a reflective layer on the selected side surface, which reduces the taper during laser cutting, and a light blocking layer to minimize seam width and prevent light leakage, along with an adhesion-reducing adhesive layer for easy removal without damaging the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is used to cut the front encapsulating film, then the display device can be manufactured efficiently, but the front encapsulating film tapers causing large tiled seams and light leakage
Solution Approach 1:
A reflective layer is introduced as an intermediary component between the front encapsulating film and the external environment. This reflective layer has a thickness of 5-20 μm and serves as a mediator to compensate for the tapering of the front encapsulating film during laser cutting, thereby reducing the visible tiled seam width and preventing light leakage without affecting the laser cutting process itself.
Solution Approach 2:
The thickness of the reflective layer is precisely controlled within the range of 5-20 μm to optimize its light-blocking function. Additionally, an adhesion-reducing adhesive layer with adhesiveness strength of 5-10 gf/25 mm is applied to enable easy removal of the reflective layer under predetermined process conditions, allowing parameter optimization without compromising manufacturing flexibility.
2Length of stationary object
If the front encapsulating film is made thinner to reduce seam width, then the tiled appearance improves, but light leakage increases due to tapering
Solution Approach 1:
The reflective layer is designed to convert the harmful effect of light leakage into a beneficial function. By positioning the reflective layer to cover the tapered region of the front encapsulating film, it reflects stray light back into the display structure, transforming potential light leakage into enhanced light utilization and improved display contrast.
3Strength
If a protective layer is added to protect underlying structures, then structural integrity improves, but the manufacturing process complexity increases
Solution Approach 1:
The reflective layer serves multiple functions simultaneously: it protects the underlying circuit backplane and connection leads during manufacturing, compensates for front encapsulating film tapering, prevents light leakage, and can be easily removed under predetermined process conditions. This multi-functionality reduces the need for separate protective layers, thereby simplifying the overall manufacturing process despite the added functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the width of the tiled seam, enhances the display effect by minimizing light leakage, and protects the underlying structures during the manufacturing process.
Implementation Method 1
the reflective layer is configured to reduce the taper of the front encapsulating film when the front encapsulating film is cut by a laser beam directed from the second main surface to the first main surface
Implementation Method 2
an adhesion-reducing adhesive layer is disposed on a surface of the reflective layer proximate to the selected side surface
Implementation Method 3
a light blocking layer is provided, and thus it is possible to prevent light leakage from the side surface and the back surface of the display panel
Data Source
AI summary
A display panel (10) includes a circuit backplane (1) and a reflective layer (3). The circuit backplane (1) includes a first main surface (11), a second main surface (12), and a plurality of side surfaces (13). The second main surface (12) is disposed opposite to the first main surface (11). The side surfaces (13) each connect the first main surface (11) and the second main surface (12). At least one side surface in the plurality of side surfaces (13) is a selected side surface (13a). The selected side surface (13a) is covered by the reflective layer (3), the reflective layer (3) being configured to be removed under a predetermined process condition.