Display Panel Vertical Interconnect Structure for Seamless Splicing
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Solution Overview
Problem
Large splicing gaps between sub-panels in Mini LED and Micro LED display panels cause dark lines, adversely affecting display quality.
Innovation Solution
A display panel design that includes multiple sub-panels with a first and second substrate, each with signal-transmission layers, and conductive transfer members that allow for vertical signal transmission between layers, eliminating the need for side-bonding with FPCs and enabling seamless splicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple sub-panels are spliced to form a large display panel, then the display area is increased, but splicing gaps are created causing dark lines that affect display quality
Solution Approach 1:
The patent transitions from horizontal side-bonding connection to vertical stacking connection. By arranging sub-panels in a stacked configuration with conductive transfer members connecting them vertically, the splicing gaps are moved from the horizontal plane to the vertical plane, thereby eliminating dark lines in the display area while maintaining large display capability.
Solution Approach 2:
The patent introduces conductive transfer members as intermediary components between sub-panels. These members serve as mediators that electrically and mechanically connect stacked sub-panels, enabling signal transmission while minimizing the impact of splicing gaps on display quality.
2Reliability
If side-bonding with FPCs is used to connect sub-panels, then electrical connection is achieved, but splicing gaps remain causing dark lines
Solution Approach 1:
The patent replaces the horizontal side-bonding approach with vertical stacking. Conductive transfer members are arranged vertically to connect sub-panels, moving the connection dimension from horizontal to vertical. This eliminates the dark lines caused by horizontal splicing gaps while maintaining reliable electrical connection through the stacked configuration.
3Ease of operation
If sub-panels are spliced with FPCs, then electrical connection is established, but wide splicing gaps create visible dark lines
Solution Approach 1:
The patent reconfigures the assembly from horizontal side-bonding to vertical stacking. Conductive transfer members are positioned vertically between sub-panels, changing the connection dimension. This approach maintains ease of assembly while significantly reducing splicing gap visibility by moving gaps to the vertical dimension where they do not affect the display area.
Data Source
AI summary
A display panel and a display device are provided. The display panel includes multiple sub-panels. The sub-panel includes a first substrate, a first signal-transmission layer disposed on the first substrate, and a light-emitting layer disposed at the first substrate and electrically coupled with the first signal-transmission layer. The display panel further includes a second substrate, a second signal-transmission layer disposed on the second substrate, and multiple conductive transfer members. The second substrate is disposed in correspondence with the multiple sub-panels and disposed opposite to and spaced apart from the first substrate. The multiple of conductive transfer members are disposed at the first substrate, where each conductive transfer member is electrically coupled with the first signal-transmission layer and the second signal-transmission layer.