Display Panel Second Metal Layer Transfer Pad Height Compensation
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Solution Overview
Problem
In ultra-narrow bezel electronic display devices, the large difference in film thickness between the array substrate and the color filter substrate causes conductive balls to fail in conducting electrodes, leading to light leakage and mura issues due to improper sizing and compression, resulting in uneven film thickness and brightness across the display panel.
Innovation Solution
The introduction of a second metal layer between the first and second insulating layers in the transfer pad region ensures the upper surface of the second insulating layer in the bus line region is flush with that in the transfer pad region, reducing the height difference and allowing conductive balls to match the exact distance between electrodes, preventing light leakage by maintaining uniform film thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the diameter of conductive balls is determined according to the distance between the upper surface of the second insulating layer and the lower surface of the second electrode layer in the bus line region, then the conductive balls can be properly sized for the bus line region, but the conductive balls in the transfer pad region cannot conduct the first electrode layer and the second electrode layer after assembly due to the large difference in film thickness
Solution Approach 1:
The patent applies local quality by introducing a second metal layer specifically in the transfer pad region to compensate for the thickness difference. This creates different structural configurations in different regions: the bus line region maintains its original structure while the transfer pad region gains an additional conductive layer, allowing each region to have optimized local properties for its specific function.
Solution Approach 2:
The patent resolves the dimensional mismatch by adding a second metal layer in the transfer pad region, effectively using an additional dimensional approach (adding a layer) to compensate for the thickness difference between regions, rather than trying to adjust the conductive ball size to fit both regions.
2Reliability
If the diameter of conductive balls is determined according to the distance between the upper surface of the first electrode layer and the lower surface of the second electrode layer in the transfer pad region, then the conductive balls can conduct electrodes in the transfer pad region, but the conductive balls in the bus line region cause the second electrode layer, light-shielding layer and second substrate to be raised after assembly, resulting in uneven film thickness and brightness
Solution Approach 1:
The patent applies local quality by introducing a second metal layer specifically in the transfer pad region to compensate for the thickness difference. This creates different structural configurations in different regions: the bus line region maintains its original structure while the transfer pad region gains an additional conductive layer, allowing each region to have optimized local properties for its specific function.
3Reliability
If the transfer pad region is designed with a large size to ensure sufficient conduction between electrodes, then electrical conduction is reliable, but the bezel size cannot be reduced for ultra-narrow bezel electronic display devices
Solution Approach 1:
The patent changes the structural parameters by introducing a second metal layer in the transfer pad region, which modifies the electrical conduction path and allows for reduced transfer pad region size while maintaining conduction reliability, thereby enabling narrower bezels.
Data Source
AI summary
The present invention is related to a display panel and an electronic display device. The present invention adds a second metal layer in a transfer pad region, so an upper surface of a second insulating layer in a bus line region is flush with an upper surface of the second insulating layer in the transfer pad region. In addition, a distance between the upper surface of the second insulating layer in the bus line region and an upper surface of a first substrate is less than a distance between a highest point of an upper surface of a first electrode layer in the transfer pad region and the upper surface of the first substrate.