Display Panel Connection Patterns With Shared Vias for Under-Screen Cameras
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Solution Overview
Problem
Current display technologies face challenges in achieving a full-screen display effect with an under-screen camera due to the high number of mask processes required for electrical connection patterns, leading to increased production costs and complexity.
Innovation Solution
A display panel design with a substrate and multiple conductive pattern layers, utilizing overlapping via holes and shared mask processes to reduce the number of mask steps, allowing for efficient coupling of conductive layers without compromising light transmittance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple mask processes are used for electrical connection patterns, then electrical connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple mask processes into a single mask process. Specifically, the first mask process simultaneously forms both the first via hole (connecting first and second conductive pattern layers) and the second via hole (connecting second and third conductive pattern layers) in one operation, thereby reducing manufacturing complexity while maintaining electrical connection reliability
Solution Approach 2:
The single mask process serves multiple functions: it forms the first via hole for connecting the first and second conductive pattern layers, and simultaneously forms the second via hole for connecting the second and third conductive pattern layers. This multi-functional approach eliminates the need for separate mask processes while ensuring reliable electrical connections across all conductive pattern layers
2Area of stationary object
If conductive pattern layers are densely arranged, then space utilization is improved, but light transmittance decreases
Solution Approach 1:
The patent applies different structural characteristics to different regions of the conductive pattern layers. The conductive pattern layers are designed with specific overlapping regions that are optimized for electrical connections, while other regions maintain higher light transmittance. The via holes are precisely positioned in overlapping regions where electrical connection is critical, minimizing their impact on overall light transmittance while maintaining dense spatial arrangement
Solution Approach 2:
The patent utilizes the vertical dimension by arranging conductive pattern layers in multiple stacked layers (first, second, and third conductive pattern layers) with via holes connecting them. This three-dimensional arrangement allows for dense space utilization in the vertical direction while maintaining horizontal light transmittance, as the via holes are small and strategically positioned rather than requiring large horizontal openings
Data Source
AI summary
A display panel includes: a substrate, a plurality of groups of electrical connection patterns and a plurality of insulating layers. Each group of electrical connection patterns include at least three conductive pattern layers that are coupled to each other. Every two adjacent conductive pattern layers are provided with an insulating layer therebetween. An insulating layer between the first conductive pattern layer and the second conductive pattern layer is provided with a first via hole extending through the insulating layer, and the second conductive pattern layer and the first conductive pattern layer are coupled through the first via hole. Multiple insulating layers between the first conductive pattern layer and the third conductive pattern layer are provided with a second via hole extending through the multiple insulating layers, and the first conductive pattern layer and the third conductive pattern layer are coupled through the second via hole.