Display Panel Side Bonding via Insulating Layer Via
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Solution Overview
Problem
Conventional side bonding technologies for display panels face issues with layer flaking off during edging of glass lateral sides and frequent short circuits due to narrow frames and gold-ball adhesives compressing the circuit under the glass.
Innovation Solution
A bonding structure that includes a through hole in the gate insulating layer allowing direct connection between the second and first metal layers, and a passivation layer isolating the gold-ball adhesive from the conductive layer, preventing short circuits and protecting the metal layers during edging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the lateral sides of the glass are edged to enable side bonding, then the bonding structure can be formed, but layers flake off due to the concave-convex surface of the circuit under the glass
Solution Approach 1:
The invention divides the connection structure into separate segments: the first metal layer remains on the glass surface while the second metal layer is formed on the lateral side through a through-hole in the passivation layer. This segmentation allows the circuit layers to be structurally separated, preventing flaking during edging while maintaining electrical connection through the through-hole.
Solution Approach 2:
The passivation layer serves as an intermediary element that isolates the first metal layer on the glass surface from the second metal layer on the lateral side. The through-hole in the passivation layer provides a controlled connection path, acting as a mediator that enables electrical connection while preventing mechanical stress transmission that would cause flaking.
2Strength
If narrow frames with gold-ball adhesive are used for side bonding, then bonding strength is improved, but short circuit occurs between transparent electrodes due to compression of the circuit under the glass
Solution Approach 1:
The passivation layer acts as an intermediary insulating barrier between the compressed gold-ball adhesive and the first metal layer circuit. This intermediary layer prevents direct electrical contact between the adhesive and conductive layers, eliminating short circuits while allowing the narrow frame structure to provide bonding strength.
Solution Approach 2:
The passivation layer is formed in advance to prevent the harmful effect of compression-induced short circuits. By establishing this insulating barrier before the bonding process, the design proactively counteracts the potential short circuit risk created by using narrow frames with compressive gold-ball adhesive.
3Reliability
If a through-hole is defined in the gate insulating layer to directly connect metal layers, then layer flaking is reduced, but the structure complexity increases
Solution Approach 1:
The through-hole in the passivation layer serves multiple functions simultaneously: it provides the electrical connection path between metal layers, acts as a stress relief feature preventing flaking, and maintains the insulating function of the passivation layer elsewhere. This multi-functionality reduces overall structural complexity despite the added through-hole feature.
Data Source
AI summary
The disclosure provides a bonding structure of a lateral side of a display panel, including an array substrate, a color filter, an inner circuit, and a lateral circuit. By defining a through hole in a gate insulating layer, a second metal layer may be directly connected to a first metal layer, thereby reducing layers flaked off from a glass when a lateral side of the glass is edged.