Display Panel Side-Surface Leads for Narrow-Bezel Tiling
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Solution Overview
Problem
Existing display apparatuses with mini OLEDs face challenges in achieving a narrow bezel and seamless tiling due to the need for a bonding region that occupies space, limiting the screen-to-body ratio and display quality.
Innovation Solution
The display panel design includes connection leads that traverse from one main surface to a selected side surface of the backplane, allowing the driver chip to be bonded to the non-display surface, reducing the bezel and enabling seamless tiling by transferring the bonding region to the back face.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding region is located on the front surface of the display panel, then the driver chip can be properly bonded and electrically connected, but the bezel width increases and the screen-to-body ratio decreases
Solution Approach 1:
The bonding region is moved from the front surface (2D plane) to the side surface of the backplane, utilizing the third dimension (depth/thickness) of the structure. This spatial relocation allows the bonding function to be achieved without occupying front surface area, thereby reducing bezel width while maintaining bonding reliability
Solution Approach 2:
Connection leads serve as intermediaries that extend from the front surface through the backplane to the bonding region on the side surface. These connection leads transmit electrical signals between the light-emitting devices and the driver chip, enabling functional connectivity despite the physical separation of components
2Reliability
If the bonding region occupies space on the display panel, then the driver chip can be mounted and function properly, but the seam width in tiled displays increases
Solution Approach 1:
The bonding region is relocated to the side surface of the backplane, utilizing the vertical dimension rather than horizontal space. This allows tiled display panels to be positioned closer together in the horizontal plane, reducing visible seam width while maintaining proper driver chip mounting and electrical connections
3Area of stationary object
If connection leads traverse through the side surface of the backplane, then the bonding region can be moved to the back face reducing bezel width, but the connection lead structure becomes more complex
Solution Approach 1:
The connection lead is divided into multiple segments or portions: a first portion on the front surface, a second portion extending through the side surface, and potentially a third portion on the back surface. This segmentation allows each portion to be optimized for its specific function and location, managing the complexity through modular design
4Adaptability or versatility
If the first portion and second portion of the connection lead have different thicknesses, then the connection can adapt to different surfaces, but manufacturing precision requirements increase
Solution Approach 1:
The connection lead exhibits different thicknesses at different locations: a first thickness for the first portion and a second thickness for the second portion. This local variation in quality allows the connection lead to be optimized for each specific surface it contacts, while the thickness ratio is controlled within a specific range (0.5-2.0) to balance adaptability with manufacturing feasibility
Data Source
AI summary
A display panel includes a backplane, a plurality of light-emitting devices, a plurality of first electrodes, and a plurality of connection leads. The backplane includes a first main surface, a second main surface and a plurality of side surfaces, and at least one side surface is a selected side surface. The plurality of light-emitting devices and the plurality of first electrodes are disposed on the second main surface. The plurality of connection leads are disposed at least on the first main surface and the selected side surface. Each connection lead includes a first portion on the first main surface and a second portion on the selected side surface, and a ratio of a thickness of the first portion to a thickness of the second portion is in a range of 0.6 and 1.6. Each connection lead is electrically connected to a first electrode.