Display Panel Side Pad Recess for Short-Circuit Prevention
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Solution Overview
Problem
Current display device manufacturing processes require additional steps for polishing the side surfaces of display panels, increasing costs and complexity, and are prone to wire short-circuits due to limited contact area of pads, leading to defects and reduced efficiency.
Innovation Solution
A display device design where wires and pads are formed together on the side surface of the display panel without additional polishing processes, using flexible printed circuit boards bonded to recess portions with anisotropic conductive films, enhancing contact area and reducing resistance, thus simplifying the manufacturing process and preventing short-circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If additional polishing processes are performed on the side surface after cutting the mother board, then the manufacturing precision of the pad position is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The pad structure is designed with recess portions and protrusions that are formed simultaneously with the mother board cutting process. The recess portions are created during the cutting step itself, allowing pads to be positioned accurately on the side surface without requiring subsequent polishing operations. This preliminary structuring resolves the contradiction by achieving precision through design rather than post-processing.
Solution Approach 2:
The cutting process and pad formation process are merged into a single operation. The mother board is cut along cutting lines that simultaneously create the recess portions for pad placement. This consolidation eliminates the need for separate polishing steps, reducing device complexity while maintaining manufacturing precision.
2Reliability
If the contact area of the pad is increased, then the reliability is improved by preventing short-circuit and reducing contact resistance, but the device complexity increases due to additional bonding structures
Solution Approach 1:
The pad structure extends from the front surface into the side surface of the mother board, utilizing the third dimension (depth) to increase contact area. The recess portions allow pads to protrude laterally, creating extended contact surfaces without requiring complex multi-layer bonding structures. This dimensional approach resolves the contradiction by achieving reliability through geometric extension rather than structural complexity.
Solution Approach 2:
The recess portions and protrusions are formed automatically during the mother board cutting process itself. The cutting lines are designed to create the pad receiving structures as a byproduct of the cutting operation. This self-service approach increases contact area for reliable connections without adding separate bonding process steps, thereby avoiding increased device complexity.
3Manufacturing precision
If wires and pads are formed separately with additional polishing processes, then the manufacturing precision is maintained, but the productivity decreases due to extended process time
Solution Approach 1:
The wire extension and pad formation are merged into a single simultaneous process. The conductive layer is patterned to form both the extension wires on the front surface and the pads in the recess portions during the same etching and deposition steps. This consolidation maintains alignment precision through unified process control while significantly improving productivity by eliminating sequential operations.
Solution Approach 2:
The recess portions for pad placement are created preliminarily during the mother board cutting process, before wire bonding occurs. This preliminary structuring allows wires to be directly bonded to pre-positioned pads without requiring subsequent polishing or alignment adjustments, maintaining precision while accelerating the overall manufacturing throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances efficiency by preventing wire short-circuits and defects through increased contact area, improving the reliability of the display device.
Implementation Method 1
an anisotropic conductive film that is disposed between the first flexible printed circuit board and the first pad
Data Source
AI summary
A display device includes a display panel, and a first flexible printed circuit board bonded to a side surface of the display panel. The display panel includes: a first substrate; a first extension wire on a top surface of the first substrate, the top surface being parallel to a first direction and a second direction, the second direction being perpendicular to the first direction; a first recess portion at a side surface of the first substrate; and a first pad that extends from the first extension wire in a third direction perpendicular to the first and second directions, the first pad being disposed in the recess portion, and the first extension wire and the first pad comprise the same material.