Display Panel Side-Routed Leads for Protected Board Connection
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Solution Overview
Problem
The manufacturing process of large-size display panels using Mini LED or Micro LED technology is complex and prone to errors, such as scratching and high manufacturing costs, due to the need to turn over the backplane and expose connections to the environment, leading to erosion and increased resistance.
Innovation Solution
A display panel design featuring a backplane with connection leads extending from one surface to the other via a side surface, covered by a protective layer, with exposed segments for connection to a circuit board, and a manufacturing method involving mask layers and patterning to form openings in the protective layer for exposure, reducing environmental exposure and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the backplane is turned over to expose connections for circuit board attachment, then the connection leads can be accessed for wiring, but the connection leads are exposed to the environment causing erosion and increased resistance
Solution Approach 1:
The connection lead extends from the first surface to the second surface of the backplane through a side surface, utilizing the third dimension (depth/thickness of backplane) to route the connection lead internally rather than exposing it on the surface. This dimensional transition allows the connection lead to be protected while still providing external access points on both surfaces for circuit board connection.
Solution Approach 2:
The connection lead is nested within the backplane structure, passing through the thickness of the backplane from one surface to the other. This nesting approach embeds the connection lead within the backplane's three-dimensional structure, protecting it from environmental exposure while maintaining electrical connectivity between circuit boards mounted on opposite surfaces.
2Ease of manufacture
If the connection lead is exposed to the environment for connection purposes, then the circuit board can be connected to the connection lead, but the connection lead is prone to erosion and resistance increase
Solution Approach 1:
The connection lead transitions from surface-level exposure to internal routing through the backplane's thickness. By moving the connection lead into the third dimension (through the backplane substrate), it is shielded from environmental factors such as moisture, oxygen, and contaminants that cause erosion and resistance increase, while still providing accessible endpoints for electrical connection.
Solution Approach 2:
The backplane substrate acts as an inert protective environment enclosing the connection lead. The backplane material creates a barrier that isolates the connection lead from harmful environmental factors, effectively providing an inert atmosphere protection without requiring additional protective coatings or seals.
3Ease of operation
If the manufacturing process requires turning over the backplane to expose connections, then the connections can be accessed, but the process becomes complex and error-prone
Solution Approach 1:
Instead of manipulating the backplane orientation (turning it over) to access connections, the connection lead extends through the thickness of the backplane to provide access points on both surfaces. This eliminates the need for complex reorientation steps in the manufacturing process, simplifying the workflow while maintaining connection accessibility.
Solution Approach 2:
The connection lead is pre-configured to extend through the backplane during the manufacturing process, establishing both connection points before final assembly. This preliminary configuration of the connection lead path eliminates the need for subsequent backplane reorientation or additional connection steps, reducing manufacturing complexity and potential errors.
4Ease of operation
If additional circuit structures are added to the backplane to manage connections, then the connection management is improved, but the manufacturing cost increases
Solution Approach 1:
The backplane serves multiple functions: it provides structural support, routes the connection lead internally through its thickness, and provides mounting surfaces for circuit boards on both sides. This multi-functionality eliminates the need for additional dedicated connection management structures, reducing material costs and manufacturing complexity while improving connection organization and protection.
Data Source
AI summary
A display panel includes a backplane including a first surface, a second surface and at least one side surface, at least one connection lead disposed on the backplane, and a first protective layer. The connection lead extends from the first surface to the second surface via a side surface in the at least one side surface. The connection lead includes a first lead segment located on the first surface, a second lead segment located on the second surface, and a third lead segment located on the side surface and connecting the first lead segment and the second lead segment. The first protective layer covers at least the first lead segment and the third lead segment. At least one opening is disposed in the first protective layer, and at least a portion of the second lead segment is exposed by an opening in the at least one opening.