Display Panel Sidewall Wiring for Seamless Micro-LED Splicing
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Solution Overview
Problem
The challenge in creating large-sized display panels is the difficulty in achieving seamless splicing of micro-LED display panels, which results in visible seams and reduced display quality due to the visibility of wirings and driving circuit devices, and the high manufacturing costs and inefficiencies associated with the mass transfer process of micro-LED dies.
Innovation Solution
A display panel formed by splicing substrates with a unique configuration where light-emitting elements are disposed on a light output surface connected to a sidewall forming a non-180° angle, with a patterned conductive layer on the sidewall and a driving circuit device adjacent to the edge, electrically connected to the light-emitting elements, and a black light-shielding layer covering the driving circuit device to prevent reflection and improve image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple small-sized micro-LED display panels are spliced into a larger-sized display panel, then the display size is increased, but the wirings and driving circuit devices on the edge become visible and affect display quality
Solution Approach 1:
The patent extracts the harmful elements (wirings and driving circuit devices) from the visible display area by relocating them to the non-visible edge region of the substrate. The light-emitting elements are arranged such that their associated wirings and driving circuits are positioned at the periphery where they cannot be seen during normal viewing, thus eliminating the visual pollution while maintaining the large display area achieved through splicing.
Solution Approach 2:
The patent utilizes the edge dimension of the substrate by arranging light-emitting elements in a specific pattern where their associated wirings and driving circuit devices are disposed along the peripheral edge. This dimensional relocation from the central display area to the edge region allows the large-sized spliced panel to maintain high display quality without visible wirings or circuits.
2Productivity
If a large number of micro-LED dies are transferred at one time, then processing efficiency is improved, but expensive transferring tools with extremely high precision are required and process yield is difficult to increase
Solution Approach 1:
The patent applies segmentation by dividing the large array of micro-LED dies into smaller transfer units or batches. Instead of attempting to transfer all dies simultaneously with complex high-precision tools, the process is broken down into multiple manageable transfer operations, reducing the precision requirements for each individual transfer tool while maintaining overall high productivity through systematic batch processing.
Data Source
AI summary
A display panel formed by connecting a plurality of panels, includes a first substrate, a plurality of first light-emitting elements, a first patterned conductive layer and a first driving circuit device. The first substrate has a first light output surface and a first sidewall, wherein the first sidewall connects to the first light output surface, and forms a non-180° angle with the first light output surface. The first light-emitting elements are disposed on the first light output surface. The first patterned conductive layer is disposed on the first sidewall. The first driving circuit device is disposed on the first substrate, adjacent to an edge of the first substrate and electrically connected to one of the first light-emitting elements.