Display Panel Signal Transfer Line Thermal Expansion Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Display panels with holes face challenges in maximizing the displayable region while ensuring package yield and reliability, as the design often requires signal lines to be positioned away from the hole, reducing the displayable area and potentially failing due to thermal expansion issues during the packaging process.
Innovation Solution
A display panel design that includes signal transfer lines with a smaller coefficient of thermal expansion (between 4.8 × 10−6/K and 14.2 × 10−6/K) overlapped with a sealant pattern, allowing for efficient signal transmission between the display and package regions, and using an insulating layer with contact vias to connect signal lines, thereby maximizing the displayable area and preventing thermal peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal lines are positioned away from the hole to ensure package yield, then package reliability is improved, but the displayable region is reduced
Solution Approach 1:
The patent introduces a transfer region that extends signal lines from the display region through the package region to the backside of the substrate. This three-dimensional routing approach allows signal lines to pass through the Z-direction (thickness direction) rather than being constrained to the planar X-Y direction, thereby maximizing the displayable region while maintaining package reliability.
Solution Approach 2:
The substrate is divided into distinct functional regions: display region, package region, and transfer region. This segmentation allows signal lines to be routed through the transfer region without interfering with the displayable area in the display region, resolving the conflict between package yield and displayable region.
2Ease of manufacture
If signal transfer lines have high coefficient of thermal expansion, then ease of manufacture is improved, but thermal peeling occurs during packaging process
Solution Approach 1:
The patent specifies a controlled coefficient of thermal expansion range (4.8-14.2 × 10^-6/K) for signal transfer lines in the package region. This parameter optimization balances manufacturability with thermal stability, preventing peeling during high-temperature packaging processes while remaining achievable with standard fabrication materials.
Solution Approach 2:
Different regions of the substrate use signal lines with different properties: the display region uses conventional signal lines, while the package region uses signal transfer lines with specifically controlled thermal expansion coefficients. This local differentiation addresses the thermal stability issue in the package region without compromising the overall manufacturing process.
3Area of stationary object
If displayable region is maximized, then product appearance is improved, but signal line routing becomes more difficult
Solution Approach 1:
By utilizing the Z-direction (thickness direction) of the substrate, the patent creates a transfer region that routes signal lines vertically through the package region. This three-dimensional routing simplifies the planar routing complexity and allows the display region to be maximized without compromising signal line routing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the package yield and operation reliability by maximizing the displayable region and preventing signal transfer line peeling due to high temperatures, ensuring effective signal transmission and improved reliability.
Implementation Method 1
The first signal lines are electrically connected to the signal transfer lines through the contact vias
Implementation Method 2
The coefficient of thermal expansion of the signal transfer lines is smaller than the coefficient of thermal expansion of the first signal lines
Implementation Method 3
The sealant pattern is disposed in the package region, and is overlapped with the signal transfer line
Data Source
AI summary
A display panel including a substrate, pixel structures, multiple first and second signal lines, signal transfer lines and a sealant pattern is provided. The substrate has a package region, a display region surrounding the package region and a transfer region positioned between the package region and the display region. The pixel structures, the first and second signal lines are disposed in the display region and each pixel structure is electrically connected to one corresponding first and second signal line. The signal transfer lines are disposed in the package region and electrically connected to the first signal lines. The coefficient of thermal expansion of the signal transfer lines is smaller than the first signal lines. The sealant pattern disposed in the package region is overlapped with the signal transfer lines. A display panel including a signal transfer line whose coefficient of thermal expansion is between 4.8(10−6/K) and 14.2(10−6/K) is also provided.