Display Panel Single-Layer Wiring Layout to Prevent Short Circuits
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Solution Overview
Problem
The current display panel designs with metal wirings in multiple layers are prone to short circuits, leading to high costs and other issues.
Innovation Solution
The display panel design integrates the power line, partition channel wirings, and grounding signal wiring in the same layer, with driving chips and light-emitting lamp groups positioned between them, reducing the risk of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If metal wirings are disposed in two or more layers, then wiring functionality is achieved, but short circuit risk increases
Solution Approach 1:
The patent merges multiple wiring functions (power supply, grounding, signal transmission, partitioning) into a single planar layer. Different wiring types are arranged as parallel conductive traces on the same substrate, eliminating vertical stacking and thereby eliminating the short circuit risk between layers while maintaining all necessary wiring functionalities.
Solution Approach 2:
The patent transitions from a three-dimensional multi-layer wiring structure to a two-dimensional planar wiring structure. By redistributing all wiring functions across the horizontal plane rather than stacking them vertically, the design achieves the same functionality without the reliability penalty of inter-layer short circuits.
2Device complexity
If multiple wiring layers are used, then wiring functionality is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple wiring layers into a single planar layer, reducing the number of fabrication steps required. This simplification of the manufacturing process directly lowers production costs while maintaining all necessary wiring functionalities through careful planar arrangement.
Solution Approach 2:
The single wiring layer performs multiple functions simultaneously (power supply, grounding, signal transmission, and partitioning), making the structure more versatile and reducing manufacturing complexity. This multi-functional approach eliminates the need for separate dedicated layers for each function.
3Device complexity
If power line and grounding wiring are in different layers, then wiring organization is achieved, but short circuit risk increases
Solution Approach 1:
The patent combines power lines and grounding wires in the same planar layer but spatially separates them through parallel arrangement and adequate spacing. This approach maintains clear organizational distinction between different wiring types while eliminating the vertical proximity that causes short circuits in multi-layer structures.
Solution Approach 2:
The patent applies different spatial arrangements to different wiring types within the same layer. Power lines and grounding wires are positioned with specific spacing and routing patterns optimized for their respective functions, achieving proper organization while preventing harmful interactions through localized design adjustments.
Data Source
AI summary
A display panel is provided, including a power line, light-emitting lamp groups, partition channel wirings, driving chips, and a grounding signal wiring. The driving chips, the light-emitting lamp groups, and the partition channel wirings are disposed between the power line and the grouping signal wiring spaced apart. The driving chips are connected to the grounding signal wiring. The light-emitting lamp groups are connected to the power line. The partition channel wirings are connected to the light-emitting lamp groups. The power line, the grounding signal wiring, and the partition channel wirings are disposed in a same layer.