Display Panel Split PCB Layout for External Drive Heat Control
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Solution Overview
Problem
The increasing frame rate in display apparatuses leads to higher power consumption and heat generation, causing temperature rises that affect the performance and service life of the display panel, particularly due to the arrangement of printed circuit boards on the back of the display panel, resulting in imbalanced light emission and reduced lifespan of the light emitting devices.
Innovation Solution
The display panel is designed with a split printed circuit board configuration, where a wiring circuit board is placed on the display substrate side and a drive circuit board is separated outside, connected via flexible printed circuits, with a drive separation design that avoids overlapping projections and includes temperature sensors and silicone pads for heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the frame rate is increased to improve display performance, then the display quality is improved, but the power consumption and heat generation increase
Solution Approach 1:
The printed circuit board is divided into two separate boards: a wiring circuit board mounted on the display substrate and a drive circuit board mounted externally. This segmentation allows the heat-generating drive circuits to be physically separated from the light-emitting devices, reducing thermal impact while maintaining high frame rate performance
Solution Approach 2:
The drive circuit board is extracted from the display substrate and mounted externally on the housing. This extraction removes the primary heat source from proximity to the light emitting devices, enabling high frame rate operation without excessive heat accumulation that would otherwise increase power consumption and reduce device lifespan
2Device complexity
If the printed circuit board is placed on the back of the display panel to simplify structure, then the device complexity is reduced, but the heat dissipation is insufficient and affects light emitting device lifespan
Solution Approach 1:
The circuit board is segmented into wiring and drive functions across two separate boards. The wiring circuit board remains on the display substrate for structural simplicity, while the drive circuit board is separated to improve heat dissipation, thus maintaining reliability without significantly increasing overall structural complexity
Solution Approach 2:
A flexible printed circuit board acts as an intermediary connection between the wiring circuit board and drive circuit board. This flexible connector enables the separation of heat-generating drive circuits from the display substrate while maintaining electrical connectivity, solving both heat dissipation and structural integration requirements
3Temperature
If the drive circuit board is separated outside the display substrate to improve heat dissipation, then the temperature control is improved, but the device complexity increases
Solution Approach 1:
The flexible printed circuit board serves as an intermediary that connects the separated drive circuit board to the wiring circuit board on the display substrate. This intermediary enables external mounting of the drive circuit board for improved heat dissipation while maintaining a relatively simple overall structure through flexible connectivity
Solution Approach 2:
A flexible printed circuit board is used to connect the drive circuit board to the display substrate. This flexible film structure allows the drive circuit board to be mounted externally on the housing while maintaining electrical connection, achieving better heat dissipation without requiring complex rigid structural modifications
4Length of stationary object
If the wiring circuit board is mounted on the display substrate to reduce overall thickness, then the compactness is improved, but the heat affects the light emitting devices
Solution Approach 1:
The circuit board is segmented into wiring and drive functions on two separate boards. The thin wiring circuit board is mounted on the display substrate to maintain compactness, while the drive circuit board is separated to eliminate heat impact on light emitting devices, thus resolving both thickness and temperature concerns
Data Source
AI summary
A display panel and a display apparatus. The display panel includes a display substrate, a first printed circuit board and a second printed circuit board, wherein the display substrate includes a display area and a bonding area located on a side of the display area, the bonding area is connected with the first printed circuit board through a first flexible printed circuit, and the first printed circuit board is connected with the second printed circuit board through a second flexible printed circuit; and the first printed circuit board is a wiring circuit board mounted with a signal connection line, the second printed circuit board is a drive circuit board mounted with a drive chip, and an orthographic projection of the second printed circuit board on a plane of the display panel does not overlap with an orthographic projection of the display substrate on the plane of the display panel.