Display Panel Insulation Grooves for Thermal Stress Delamination

The insulation layers are segmented by forming grooves that divide the continuous layer into sections. These grooves create expansion spaces that accommodate thermal stress, preventing the layers from disengaging while maintaining binding strength in the non-groove areas.

The grooves are locally positioned in specific regions where thermal stress concentration is most likely to occur. This local modification allows the insulation layers to maintain strong binding in most areas while providing stress relief at critical locations, resolving the contradiction between overall binding strength and local stress resistance.

The groove structure segments the insulation layer in a simple periodic pattern, which can be efficiently formed using standard photolithography and etching processes. This segmentation approach achieves stress relief without requiring complex manufacturing equipment or multi-step procedures.

The groove dimensions (width, depth, spacing) are optimized as specific parameters to achieve the desired stress relief effect. By controlling these geometric parameters within certain ranges, the manufacturing process remains simple while effectively preventing disengagement under thermal stress.

Instead of uniformly increasing the thickness of the entire insulation layer, grooves are formed to create local expansion spaces. This segmentation approach maintains the original layer thickness while providing stress relief, avoiding the need to increase overall device thickness.

The groove structure provides localized stress management at specific interfaces rather than requiring uniform thickening throughout. This local modification maintains the original device thickness while effectively preventing disengagement at critical stress points.