Display Panel Support Block Thickness Variation for Bend Stress
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Solution Overview
Problem
The bending process of display panels to reduce bezel size often results in wiring breakage due to stress from the bonding and display regions, leading to display failures and reduced yield.
Innovation Solution
A display panel design featuring a support block with varying thickness in the bend and bonding regions, where the maximum thickness in the bonding region supports the bend region, reducing stress and preventing wiring breakage, and potentially replacing the need for additional raising blocks, thus simplifying attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the bonding region is bent to the back to reduce bezel size, then the screen-to-body ratio is improved, but wiring in the bend region is easily broken
Solution Approach 1:
The support block is designed with non-uniform thickness, where the thickness in the bend region is specifically optimized to be less than or equal to the thickness in the bonding region. This local variation in thickness provides targeted support to the bend region, distributing stress evenly and preventing wiring breakage during bending while maintaining the overall bending capability for high screen-to-body ratio
Solution Approach 2:
The support block is pre-configured with specific thickness characteristics before the bending process. By establishing the thickness relationship (thickness in bend region ≤ thickness in bonding region) in advance, the structure is prepared to withstand bending stresses, preventing wiring breakage before it occurs during the actual bending operation
2Reliability
If the thickness of the support block in the bend region is increased to prevent wiring breakage, then wiring integrity is improved, but the bending difficulty increases
Solution Approach 1:
Rather than uniformly increasing the thickness throughout the support block, the invention applies thickness variation locally: the support block thickness in the bend region is specifically controlled to be less than or equal to the thickness in the bonding region. This localized thickness optimization provides necessary support for wiring integrity while maintaining bendability
Solution Approach 2:
The invention optimizes the thickness parameter of the support block by establishing a specific relationship between thickness in different regions (thickness in bend region ≤ thickness in bonding region). This parameter optimization achieves the balance between providing sufficient support to prevent wiring breakage and maintaining the flexibility needed for bending
3Reliability
If a raising block is added to support the bend region, then wiring integrity is improved, but the device complexity increases
Solution Approach 1:
The invention merges the support function with the existing support block structure rather than adding a separate raising block. By integrating the bending support capability into the support block itself through thickness optimization, the solution eliminates the need for additional components, reducing structural complexity while maintaining wiring integrity
Solution Approach 2:
The support block is designed to serve multiple functions: it provides structural support, facilitates bending, and prevents wiring breakage through its optimized thickness profile. This multi-functional design eliminates the need for separate raising blocks, reducing overall device complexity while achieving the same protective effect
Data Source
AI summary
The application discloses a display panel and a display device. The display panel includes a substrate. The substrate includes a bonding region and a bend region connected to the bonding region. The substrate further includes a support block disposed corresponding to the bend region and the bonding region and disposed on a side of the substrate facing away from a display surface. The maximum thickness of the support block located in the bonding region is greater than the maximum thickness of the support block located in the bend region.