Display Panel Tapered Organic Layer Pad Area Reduction
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Solution Overview
Problem
Current display panels have a significant non-display area dedicated to external circuit modules and electrical wiring, which occupies valuable space and reduces the overall efficiency of the display device.
Innovation Solution
The display panel design incorporates a photosensitive polymer organic layer with a taper shape in the non-display area, allowing for a reduced pad area by integrating the signal input pad and thin film transistor, and utilizing a flexible printed circuit board to connect the external circuit module, thereby minimizing the space required for the pad area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a traditional display panel structure with separate external circuit module and electrical wiring member is used, then the display panel can be connected to external circuits, but the non-display area becomes large due to pad area and wiring space requirements
Solution Approach 1:
The patent merges the external circuit module with the display panel by integrating the driver circuit directly onto the display panel substrate. This consolidation eliminates the need for separate external circuit modules and reduces the pad area, as the driver circuit is now part of the display panel itself rather than a separate component requiring additional connection space.
Solution Approach 2:
The patent transitions from a planar connection structure to a three-dimensional stacked structure by placing the driver circuit on the back surface of the display panel substrate. This vertical integration allows electrical connections to be made through the thickness of the substrate rather than requiring large lateral pad areas, effectively moving the connection interface to another dimension.
2Area of stationary object
If the pad area is reduced to minimize non-display area, then space utilization improves, but the complexity of electrical connection increases
Solution Approach 1:
The patent resolves the complexity issue by moving the connection interface to the back surface of the substrate, creating a vertical stacking architecture. This dimensional transition simplifies the wiring structure by eliminating the need for complex lateral routing and large pad areas, as connections are now made through vertical vias and stacked layers rather than extensive planar traces.
Solution Approach 2:
The patent implements a nested structure where the driver circuit is embedded within the display panel substrate itself, with the driver circuit layer positioned beneath the display structure. This nesting integrates multiple functional layers within the same vertical space, reducing the need for separate external components and simplifying the overall electrical connection architecture.
3Volume of stationary object
If the electrical wiring member is accommodated in a separate receiving container, then the display panel and external circuit module can be independently manufactured, but the overall device volume increases
Solution Approach 1:
The patent merges the previously separate display panel and external circuit module into a single integrated structure. The driver circuit is fabricated directly on the display panel substrate using the same manufacturing processes, eliminating the need for separate receiving containers and reducing the overall device volume while maintaining manufacturing simplicity through process integration.
Solution Approach 2:
The patent reduces device volume by transitioning from a lateral arrangement with separate containers to a vertical stacked architecture. The driver circuit is positioned on the back surface of the substrate, utilizing the third dimension (thickness) rather than requiring additional lateral space, thereby minimizing the overall device footprint and volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the pad area connected to the external circuit module, allowing for a more compact display panel with improved space utilization and reduced non-display area, enhancing the overall efficiency and aesthetics of the display device.
Implementation Method 1
a photosensitive polymer organic layer disposed in the first non-display area and extending to the pad area, the photosensitive polymer organic layer having a taper shape at an end portion of the first non-display area
Data Source
AI summary
Provided is a display panel including: an array substrate; an opposite substrate facing the array substrate and including a second base substrate and a common electrode disposed on the second base substrate; and a liquid crystal layer disposed between the array substrate and the opposite substrate. The array substrate includes: a first base substrate disposed in a display area and a non-display area; a photosensitive polymer organic layer disposed in a first non-display area and extending to a pad area, the photosensitive polymer organic layer having a taper shape at an end portion of the first non-display area; a thin film transistor disposed on the first base substrate in the display area; a pixel electrode connected to the thin film transistor; and a signal input pad connected to the thin film transistor and disposed on the photosensitive polymer organic layer in the pad area.