Display Panel PCB Separation for Thermal Isolation
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Solution Overview
Problem
The existing display panel designs face challenges with heat management and thermal offset issues due to the placement of drive chips and printed circuit boards on the back of the display panel, leading to increased power consumption and reduced service life of light emitting devices.
Innovation Solution
The display panel design includes a first printed circuit board connected to a second printed circuit board through flexible printed circuits, with the second board's orthographic projection not overlapping the display substrate, allowing for improved heat dissipation and reduced thermal impact on the display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If drive chips and printed circuit boards are placed on the back of the display panel, then electrical connection and signal control are achieved, but heat management deteriorates and thermal offset issues occur
Solution Approach 1:
The patent extracts the drive circuit board from the back of the display panel and relocates it to an external position. The drive circuit board is connected to the display substrate through a flexible printed circuit board that extends from the bonding area, effectively removing the heat-generating component from proximity to the light emitting devices.
Solution Approach 2:
The flexible printed circuit board serves as an intermediary element that bridges the display substrate and the externally located drive circuit board. This mediator allows electrical connection while maintaining spatial separation, enabling signal transmission without direct thermal coupling between the drive circuit and light emitting devices.
2Temperature
If drive circuit board is relocated outside the display panel, then thermal impact on display area is reduced, but device complexity increases due to additional flexible printed circuit connections
Solution Approach 1:
The flexible printed circuit board performs multiple functions: it provides electrical connection between the display substrate and drive circuit board, enables spatial separation for thermal management, and maintains signal integrity. This multi-functional component justifies the added structural element by delivering multiple benefits simultaneously.
3Temperature
If second printed circuit board is positioned outside display substrate projection, then heat dissipation is improved, but area occupied by connection components increases
Solution Approach 1:
The patent transitions from a two-dimensional layout where all components are confined to the back of the display panel to a three-dimensional arrangement. The drive circuit board is positioned outside the projection area of the display substrate, utilizing spatial depth and external mounting surfaces, thereby achieving heat dissipation without proportionally increasing the frontal area of the display device.
Data Source
AI summary
A display panel and a display apparatus are provided. The display panel includes a display substrate, a first printed circuit board and a second printed circuit board, wherein the display substrate includes a display area and a bonding area located on a side of the display area, the bonding area is connected with the first printed circuit board, and the first printed circuit board is connected with the second printed circuit board through a second flexible printed circuit; and the first printed circuit board is a wiring circuit board mounted with a signal connection line, the second printed circuit board is a drive circuit board mounted with a drive chip, and an orthographic projection of the second printed circuit board on a plane of the display panel does not overlap with an orthographic projection of the display substrate on the plane of the display panel.