Display Panel Thermal Path Using Edge Metal and Conductive Adhesive
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Solution Overview
Problem
The existing display panels using mini-LED or micro-LED technology face heat dissipation issues due to the absence of a metal heat conduction path, leading to increased temperature, reduced luminous efficiency, and shorter service life.
Innovation Solution
Incorporating a thermally conductive adhesive and multiple layers of thermally conductive metal on the substrate, which extend to the edges of the display panel, creating a metal heat conduction path for efficient heat dissipation, thereby connecting with the thermally conductive adhesive to radiate heat externally.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If no metal heat conduction path is provided at the bottom of LED, then the structure is simpler, but heat dissipation is poor causing temperature increase
Solution Approach 1:
The patent introduces thermally conductive metal layers and thermally conductive adhesive as intermediary heat transfer paths between the LED chip and the display panel substrate. These intermediaries facilitate efficient heat conduction from the LED chip through the substrate to the edges, resolving the heat dissipation problem without requiring direct metal contact at the LED bottom.
Solution Approach 2:
The patent extends heat conduction pathways from a single-point contact to a two-dimensional network by incorporating thermally conductive metal layers that span across the substrate and connect to edges through thermally conductive adhesive. This dimensional expansion creates multiple parallel heat dissipation routes, significantly improving thermal management.
2Device complexity
If heat is transferred only through film layer, then the structure is simpler, but luminous efficiency decreases due to panel warming
Solution Approach 1:
The patent introduces thermally conductive metal layers and thermally conductive adhesive as intermediary heat transfer paths between the LED chip and the display panel substrate. These intermediaries facilitate efficient heat conduction from the LED chip through the substrate to the edges, resolving the heat dissipation problem without requiring direct metal contact at the LED bottom.
Solution Approach 2:
The patent replaces the insufficient thermal conduction mechanism (film layer only) with an enhanced thermal conduction system incorporating metal layers and thermally conductive adhesive. This substitution dramatically improves heat transfer efficiency, preventing panel warming and maintaining high luminous efficiency.
3Device complexity
If heat is transferred only through film layer, then the structure is simpler, but service life of micro-LED is shortened
Solution Approach 1:
The patent introduces thermally conductive metal layers and thermally conductive adhesive as intermediary heat transfer paths between the LED chip and the display panel substrate. These intermediaries facilitate efficient heat conduction from the LED chip through the substrate to the edges, resolving the heat dissipation problem without requiring direct metal contact at the LED bottom.
Solution Approach 2:
The patent replaces the insufficient thermal conduction mechanism (film layer only) with an enhanced thermal conduction system incorporating metal layers and thermally conductive adhesive. This substitution dramatically improves heat transfer efficiency, preventing panel warming and maintaining high luminous efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively lowers the temperature of the LED chips, improves the reliability and luminous efficiency of the display panel, and prolongs its service life by enhancing heat dissipation.
Implementation Method 1
at least one layer of the thermally conductive metal of the one or more layers of the thermally conductive metal extends to the edges of the display panel and is in contact with the thermally conductive adhesive
Implementation Method 2
the thermally conductive adhesive is provided on at least part of edges of the display panel; and the substrate is further provided with one or more layers of thermally conductive metal; at least one layer of the thermally conductive metal of the one or more layers of the thermally conductive metal extends to the edges of the display panel and is in contact with the thermally conductive adhesive
Data Source
AI summary
Provided are a display panel and a display device. The display panel includes a substrate, a driving circuit layer disposed on the substrate and including driving circuits, LED chips located on side of the drive circuit layer facing away from the substrate and each electrically connected to a corresponding drive circuit, the drive circuit includes at least one first thin film transistor with a source and a drain located at first metal layer of the drive circuit layer and electrically connected to first electrode of corresponding LED chip, and at least part of edges of the display panel is provided with thermally conductive adhesive. The substrate is also provided with one or more layers of thermally conductive metal, at least one layer of thermally conductive metal extends to the edges of the display panel and is in contact with the thermally conductive adhesive.