Display Panel Thinning via Adhesive Layer Segmentation

The patent divides the thinning process into two distinct stages: first thinning the display panel to a first thickness, then after cutting, thinning further to a second thickness. This segmentation allows the panel to maintain sufficient strength during the cutting process while achieving the desired final thinness, resolving the contradiction between thickness reduction and structural integrity preservation.

The patent performs the first thinning operation before cutting the display panel. This preliminary action ensures that the panel has adequate thickness and strength to withstand the cutting process, preventing damage while still achieving overall thinness. The preliminary thinning is followed by a second thinning after cutting, systematically addressing the strength-thickness contradiction.

The patent segments the thinning process into two phases: first thinning the entire display panel before cutting (maintaining high productivity), then performing a second thinning operation on individual cut pieces (ensuring high reliability). This segmentation allows the circuit regions to be protected during cutting while still achieving the desired thinness, resolving the contradiction between efficiency and defect-free ratio.

The second thinning operation is applied locally to the cut display panel pieces rather than to the entire motherboard. This local quality approach ensures that circuit regions are protected from corrosion during cutting, as the thinning liquid only contacts the thinned surfaces of individual pieces, not the exposed cross-sections during the cutting process.

The patent divides the thickness reduction into two stages: first reducing to a first thickness that maintains sufficient strength for cutting, then further reducing to a second, thinner thickness after cutting. This segmentation enables greater overall thickness reduction while preserving structural integrity during the critical cutting phase, as the panel is thinned in controlled steps rather than all at once.

The first thinning operation is performed as a preliminary action before cutting, establishing a thickness that balances strength requirements with thinness goals. This preliminary thinning to a first thickness provides sufficient structural integrity for cutting while enabling further thinning to a second thickness afterward, thus achieving greater overall thickness reduction without compromising strength during the cutting process.