Display Panel Three-Layer Fan-Out Wiring Narrow Bottom Frame
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Solution Overview
Problem
Existing display panels face challenges in achieving a narrow bottom frame design due to insufficient wiring space in the fan-out wiring area, caused by the need for close spacing and wide fan-out lines, which limits the ability to efficiently arrange multiple signal lines.
Innovation Solution
Implementing a three-layer wiring format for the fan-out wiring area, where fan-out lines are distributed across different layers, reducing the spacing and width of the wiring area and allowing for a more compact design by reusing existing metal layers and optimizing the arrangement of conductive connection portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple fan-out lines are placed side by side in the same layer, then electrical connection to signal lines is achieved, but wiring space becomes excessively large
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of fan-out lines to a three-dimensional multi-layer configuration. Fan-out lines are distributed across different layers (first fan-out line in first layer, second fan-out line in second layer, third fan-out line in third layer), allowing vertical stacking that reduces the horizontal wiring space while maintaining electrical connectivity to signal lines.
2Reliability
If fan-out lines are arranged in an intersecting pattern with signal lines, then signal transmission is enabled, but the bottom frame width increases
Solution Approach 1:
The patent uses multi-layer wiring to route fan-out lines vertically through different layers, allowing them to connect to signal lines without requiring excessive horizontal space in the bottom frame area. This layered approach enables compact signal transmission paths.
Solution Approach 2:
The fan-out lines are segmented and assigned to different layers based on their connection requirements. The first fan-out line connects to a first signal line, the second fan-out line connects to a second signal line, and the third fan-out line connects to a third signal line, with each connection occurring at different vertical positions, thereby optimizing the bottom frame layout.
3Manufacturing precision
If process capability limitations are considered with 3 μm spacing and 3 μm width requirements, then manufacturing precision is maintained, but wiring area becomes insufficient
Solution Approach 1:
By utilizing the vertical dimension through multi-layer wiring, the patent accommodates multiple fan-out lines with the required 3 μm spacing and 3 μm width without increasing the horizontal wiring area. The layered structure allows dense packing while maintaining manufacturing precision specifications.
Data Source
AI summary
A display panel includes a substrate that comprises a display area and a non-display area. In the display area, a plurality of first signal lines are arranged along a first direction, and extend along a second direction. The non-display area includes a fan-out wiring area and a binding area, and the fan-out wiring area is located between the display area and the binding area. A plurality of fan-out lines are located in the fan-out wiring area, and a plurality of conductive connection portions are located in the binding area. The fan-out lines include a first fan-out line, a second fan-out line, and a third fan-out line, and a first end of the first fan-out line, a first end of the second fan-out line, and a first end of the third fan-out line are electrically connected to the first signal lines respectively. The first fan-out line, the second fan-out line, and the third fan-out line are located at different layers respectively. The plurality of conductive connection portions are electrically connected to a second end of the first fan-out line, a second end of the second fan-out line, and a second end of the third fan-out line in one-to-one correspondence.