Display Panel Through-Hole Adhesive for Precise Chip-on-Film Bonding
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Solution Overview
Problem
The manufacturing process of display panels with high screen-to-body ratio is complicated by the need for protective adhesives to support and seal conductive adhesives, leading to issues like glue overflow and insufficient dispensing, which results in low yield and increased costs.
Innovation Solution
A display panel design that includes through-holes in the adhesive layer for precise placement of conductive adhesive, eliminating the need for additional protective adhesives, and incorporates a support layer and heat dissipation buffer composite layer to enhance electrical connection and encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protective adhesives are added to support and seal conductive adhesive, then electrical performance and reliability are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts and eliminates the protective adhesive layer from the structure. By designing the conductive adhesive to directly contact both the binding terminal and connection terminal without requiring protective adhesive for support or sealing, the patent simplifies the manufacturing process while maintaining electrical performance through alternative design choices in conductive adhesive formulation and application method.
Solution Approach 2:
The conductive adhesive is designed to perform multiple functions simultaneously: providing electrical connection, mechanical support, and environmental sealing all in one layer. This multi-functional approach replaces the need for separate protective adhesive layers, reducing structural complexity while maintaining reliability.
2Reliability
If protective adhesives are used to support conductive adhesive, then electrical connection is ensured, but manufacturing precision and dispensing control deteriorate
Solution Approach 1:
By removing the protective adhesive layer, the patent eliminates the complex dispensing operations required for applying multiple adhesive layers. The conductive adhesive is applied directly in its final position, simplifying dispensing control and improving manufacturing precision while maintaining electrical connection reliability through optimized conductive adhesive formulation.
Solution Approach 2:
The conductive adhesive is pre-formulated with enhanced properties (such as adjusted viscosity and curing characteristics) to enable direct application without protective adhesive support. This preliminary optimization of the conductive adhesive allows for precise dispensing and reliable electrical connection in a single-step process.
3Reliability
If multiple adhesive layers are used, then electrical performance is protected, but productivity and yield deteriorate
Solution Approach 1:
The patent removes the protective adhesive layer from the multi-layer adhesive structure. This extraction reduces the number of manufacturing steps, minimizes potential failure points in the assembly process, and simplifies quality control, thereby improving production yield while maintaining electrical performance through the optimized conductive adhesive design.
Solution Approach 2:
The conductive adhesive is designed as a multi-functional material that provides electrical connection, mechanical bonding, and environmental protection simultaneously. This eliminates the need for separate protective adhesive layers, reducing manufacturing complexity and improving productivity while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, reduces material usage, and improves yield by ensuring uniform adhesive distribution and enhanced encapsulation, resulting in improved display quality and stability.
Implementation Method 1
a conductive adhesive is disposed in the first through-hole, and the connection terminal is electrically connected to the binding terminal through the conductive adhesive
Implementation Method 2
an adhesive layer disposed on the backlight side of the display panel body, the adhesive layer including a plurality of first through-holes
Data Source
AI summary
A display panel and a manufacturing method thereof. The display panel includes a display panel body having a plurality of binding terminals disposed on a backlight side of the display panel body; an adhesive layer including a plurality of first through-holes; a chip on film including a chip on film body portion in contact with an adhesive layer, a plurality of connection terminals being provided on a side of the chip on film body portion facing toward the adhesive layer; where a conductive adhesive is disposed in the first through-hole, and the connection terminal is electrically connected to the binding terminal through the conductive adhesive.