Display Panel Through-Hole Wiring for Borderless Signal Reliability
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Solution Overview
Problem
Existing borderless and bezel-free display designs face challenges in achieving high resolution due to stress issues with flexible printed circuits and potential breakage of metal driving wiring, which hinder effective signal transmission to the display panel.
Innovation Solution
A display panel with a substrate featuring through holes allows the driving wiring to connect from the front surface to a solder pad on the back surface via these holes, eliminating the need for non-active area wiring and reducing stress, and a manufacturing method that includes forming conductive patterns and thin-film transistors on the substrate, separating it from the base substrate, and connecting a circuit board to the solder pad on the back surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a flexible printed circuit is bent 180 degrees to connect driving wiring behind the display panel, then the driving wiring can be hidden behind the active area achieving borderless design, but the bending stress may cause connection failure and prevent signal transmission
Solution Approach 1:
The driving wiring is routed through the thickness dimension of the substrate via through-holes, transitioning from a planar surface connection to a three-dimensional path. This allows the wiring to pass through the substrate from front to back surface, eliminating the need for external bending connections and achieving borderless design without compromising signal transmission reliability.
Solution Approach 2:
The driving wiring is extracted from the traditional external connection method and integrated directly into the substrate structure through through-holes. This removes the vulnerable bent flexible circuit portion from the system, eliminating the source of bending stress while maintaining the borderless aesthetic.
2Measurement precision
If metal driving wiring is used for high resolution display, then high pixels per inch can be achieved, but the wiring may break due to bending stress affecting signal transmission
Solution Approach 1:
The metal driving wiring is routed through the substrate thickness dimension via through-holes rather than being bent externally. This three-dimensional routing protects the fragile high-resolution metal wiring from bending stresses that would cause breakage, while maintaining the high pixels per inch capability.
3Reliability
If a predetermined distance is maintained from the bent outermost edge to the bonding portion, then connection reliability can be maintained, but the lower frame size cannot be reduced
Solution Approach 1:
The connection path is moved from the lateral dimension (requiring frame space) to the thickness dimension (through-holes in the substrate). This eliminates the need for lateral clearance between bent edges and bonding portions, allowing the lower frame size to be minimized while maintaining connection reliability through the vertical through-hole path.
Solution Approach 2:
The substrate itself acts as a flexible structure that can accommodate the through-hole wiring path. By utilizing the substrate's thickness and flexibility, the design achieves reliable connections without requiring additional lateral space in the frame portions.
Data Source
AI summary
The present disclosure provides a display device and a manufacturing method thereof, and a display panel. The display panel may include a substrate defining a through hole; a driving wiring carried on the substrate; a solder pad being arranged on a back surface of the substrate. A first end of the driving wiring is located on a front surface of the substrate, and a second end of the driving wiring is connected to the solder pad via the through hole.