Display Panel Through-Hole Wiring for Narrow-Bezel Splicing
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Solution Overview
Problem
Current mini LED display panels require a relatively long outer lead bonding (OLB) region for chip on film (COF) and printed circuit board (PCB) bonding, resulting in a wide frame and large splice joints during panel splicing, which affects the display effect.
Innovation Solution
The display panel design includes a first substrate with a signal wiring portion and a first outer lead wiring portion, and a second substrate with a second outer lead wiring portion, connected through a bridging wiring portion in a through-hole. This configuration separates the OLB region into two parts, with the second outer lead wiring used for bonding and the first outer lead serving only for signal transmission, thereby narrowing the frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a long outer lead bonding region is reserved for COF and PCB bonding, then reliable electrical connection is achieved, but the frame width becomes wide
Solution Approach 1:
The patent divides the outer lead bonding structure into two separate substrates: a first substrate containing the display region with signal wiring and a first outer lead wiring portion, and a second substrate containing a second outer lead wiring portion. The through-hole portion with bridging wiring connects these two substrates, segmenting the bonding function from the display region and enabling independent optimization of each component's dimensions.
Solution Approach 2:
The patent transitions from a planar bonding structure to a three-dimensional structure by introducing a through-hole portion that penetrates through the first substrate and connects to the second substrate. This vertical dimension allows the outer lead wiring portions to be distributed across different planes, reducing the horizontal frame width while maintaining electrical connection reliability.
2Reliability
If a long outer lead bonding region is used for panel bonding, then bonding reliability is improved, but splice joint size increases during panel splicing
Solution Approach 1:
The patent segments the bonding interface into discrete through-hole portions distributed across the panel, rather than requiring a continuous long bonding region. Each through-hole provides an independent bonding point, allowing multiple small bonding joints instead of one large splice joint, thereby reducing the overall splice joint area while maintaining reliable electrical connections.
3Device complexity
If the first outer lead wiring is used for both signal transmission and bonding, then device complexity is reduced, but frame width increases
Solution Approach 1:
The patent segments the wiring functions by creating distinct wiring portions: the first outer lead wiring portion on the first substrate is optimized for signal transmission with narrower width, while the second outer lead wiring portion on the second substrate handles bonding functions. This functional segmentation allows each wiring portion to be dimensioned independently according to its specific requirements.
Solution Approach 2:
The patent extracts the bonding function from the first outer lead wiring portion and assigns it to the second outer lead wiring portion on the second substrate. This extraction allows the first outer lead wiring to be narrowed for signal transmission purposes only, while the bonding function is fulfilled separately through the through-hole connection structure.
Data Source
AI summary
The present disclosure discloses a display panel and a method for preparing a display panel. The display panel includes a first substrate, a second substrate, a signal wiring portion, a first outer lead wiring portion, a second outer lead wiring portion, a through-hole portion, and a bridging wiring portion. The first outer lead wiring portion is disposed on a side surface of the first substrate along a light emitting direction of the display panel, and the second outer lead wiring portion is disposed on a side surface of the second substrate away from the first substrate and is electrically connected to the first outer lead wiring portion through the bridging wiring portion disposed in the through-hole portion.