Display Panel Groove Layout for Residue-Free Touch Routing
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Solution Overview
Problem
The manufacturing process of display panels results in touch material residue during exposure and etching, leading to short circuits and touch failures due to deeper grooves in the planarization layer, which complicates the production and affects the functionality of the touch sensor panel.
Innovation Solution
The display panel design includes a first groove with a reduced depth by incorporating an organic layer in the groove corresponding to the first segment boundary, ensuring the touch material residue is minimized, and the touch signal lines are properly connected to the pad region without interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the planarization layer is etched deeper to expose touch material, then touch trace formation is enabled, but touch material residue remains in the groove causing short circuits
Solution Approach 1:
The patent applies preliminary action by forming a filler layer in the groove before the etching process that removes touch material. This filler layer is strategically positioned to prevent touch material residue from remaining in the groove after etching, thereby preventing short circuits. The filler layer acts as a placeholder that maintains groove structure during manufacturing while ensuring clean trace formation without residual material causing reliability issues.
2Reliability
If the groove depth is increased to allow touch signal line connection, then electrical connectivity is achieved, but manufacturing complexity increases due to residue removal difficulties
Solution Approach 1:
The patent introduces an intermediary filler layer that mediates between the groove structure and the touch material. This filler layer simplifies the manufacturing process by eliminating the need for complex residue removal steps. The filler layer acts as a temporary structure that facilitates touch signal line connection through the groove while preventing material residue, thereby reducing manufacturing complexity despite maintaining necessary groove depth for electrical connectivity.
3Manufacturing precision
If exposure depth is increased to reach deeper grooves, then touch material can be etched, but touch material residue is generated causing short circuits
Solution Approach 1:
The patent converts the potential harm of deep groove exposure into a benefit by using the filler layer as a protective element. Instead of trying to prevent residue formation through more aggressive etching, the filler layer is designed to be present during etching to catch and contain any residual touch material. This transforms the exposure depth issue from a harmful factor generating residue into a controlled process where the filler layer benefits from the deep exposure while preventing the harmful residue effect.
Data Source
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AI summary
The present disclosure relates to a display panel, a manufacturing method thereof, and a display device, and belongs to the field of displays. The display panel includes: a substrate having a display region, a peripheral region and a pad region; a first dam disposed in the peripheral region and surrounding the display region; a planarization layer disposed within the first dam with a first groove between the first dam and the planarization layers, wherein an edge of a first side of the planarization layer includes a first segment boundary and a second segment boundary in connection with each other along an extending direction of the edge of the first side; a packaging layer covering the planarization layer; and a touch layer disposed on the packaging layer, wherein the touch layer includes touch signal lines traveling through the first segment boundary and a touch electrode pattern electrically connected to a pad in the pad region through the touch signal lines; wherein the packaging layer includes an organic layer with an edge disposed in the first groove, and a distance between the edge of the organic layer and the first segment boundary of the planarization layer is greater than a distance between the edge of the organic layer and the second segment boundary.