Display Panel Manufacturing via Transfer Base and Laser Peeling
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Solution Overview
Problem
Existing manufacturing methods for display panels face challenges in reducing the thickness of substrates while maintaining substrate smoothness and efficiency in the assembly process.
Innovation Solution
A manufacturing method involving the formation of spacers and frames on transfer bases, followed by vacuum attachment to substrates, and subsequent laser cutting to create air paths for peeling, allowing for precise thickness control and improved smoothness of substrates, with the option of using adhesive frames for enhanced attachment forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If hydrofluoric acid etching is used to decrease substrate thickness, then substrate thickness is reduced, but substrate smoothness deteriorates
Solution Approach 1:
The patent introduces a transfer base as an intermediary component between the substrate and the final product. The transfer base with controlled roughness serves as a mediator that allows thickness reduction through etching while maintaining the external smoothness requirement, as the rough surface is confined to the transfer base rather than the final substrate surface
Solution Approach 2:
The substrate system is segmented into multiple components: the substrate itself, the transfer base, and the frame structure. This segmentation allows the rough surface characteristic to be isolated to the transfer base component while the substrate maintains its smooth surface requirement, resolving the contradiction between thickness reduction and smoothness maintenance
2Length of moving object
If transfer bases are used for substrate attachment, then substrate thickness can be decreased, but process complexity increases
Solution Approach 1:
The transfer base is designed as a temporary component that is discarded after serving its purpose in thickness control and attachment. The laser-cut air paths enable easy separation and removal of the transfer base, converting a potentially complex permanent structure into a simple temporary aid that is recovered (removed) after use
Solution Approach 2:
The patent replaces traditional mechanical attachment methods with vacuum attachment through the frame structure. This substitution simplifies the attachment process by eliminating complex mechanical fastening systems while achieving secure bonding between the transfer base and substrate through vacuum pressure
3Strength
If vacuum attachment is used to attach transfer bases to substrates, then attachment strength is improved, but attachment force control becomes more difficult
Solution Approach 1:
The frame structure on the transfer base creates a replicated vacuum chamber that copies the vacuum attachment mechanism from the substrate to the transfer base interface. This copying approach ensures uniform vacuum distribution and consistent attachment strength across the entire bonding area, making the attachment force easily controllable through vacuum pressure regulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively decreases substrate thickness within a range of 0.1-0.3 mm, enhances surface smoothness, and enables recycling of transfer bases, thereby improving the overall manufacturing process for display panels.
Implementation Method 1
a vacuum chamber is formed, the transfer base is attached to the substrate in the vacuum chamber in response to a vacuuming of the chamber
Implementation Method 2
the frame is cut by a laser to form air paths
Data Source
AI summary
A method for manufacturing a display panel is provided. A plurality of first spacers and a first frame are formed on a first transfer base, and a plurality of second spacers and a second frame are formed on a second transfer base. A first substrate and a second substrate are respectively attached to the first transfer base and the second transfer base to form a first substrate combination and a second substrate combination respectively. A TFT array is formed on a surface of the first substrate, and a color filter layer is formed on a surface of the second substrate. The first substrate combination is reversed to be attached to the second substrate combination. Air paths are formed on the first frame and the second frame for peeling the first transfer base and the second transfer base, thus the display panel is removed after the peeling operation.