Display Panel Transfer Pad ESD Protection Design
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Solution Overview
Problem
In the manufacturing of display panels, particularly OLEDs, static electricity can lead to electrostatic discharge (ESD) causing short circuits between conductive layers, resulting in horizontal or vertical dark lines due to charge accumulation on scan signal lines and insulation film breakdown.
Innovation Solution
The display panel design includes conductive blocks in different layers, electrically insulated from scan and gate signal lines, with transfer pads and lines configured to store charges and reduce ESD risk, and a repairing method to cut short-circuited wire segments to resolve such issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If scan signal lines are used to transmit signals across the display panel, then signal transmission is enabled, but charge accumulation occurs leading to electrostatic discharge and short circuits
Solution Approach 1:
The patent introduces a transfer pad as an intermediary component between the scan signal line and the first conductive block. This transfer pad serves as a mediator that enables controlled charge transfer while preventing direct electrostatic discharge. The transfer pad is electrically connected to the scan signal line and positioned to overlap with the first conductive block, allowing it to act as a buffer that manages charge accumulation and releases it safely, thereby eliminating ESD damage while preserving signal transmission functionality.
Solution Approach 2:
The patent extracts the charge storage function from the scan signal line itself and relocates it to a separate first conductive block in a different layer. By separating the signal transmission path (scan signal line) from the charge accumulation path (first conductive block), the design prevents charge buildup on the signal line while maintaining the ability to store and manage charges through the transfer pad mechanism, thus resolving the ESD issue without compromising signal integrity.
2Volume of moving object
If conductive layers are placed close together to reduce panel thickness, then manufacturing complexity increases due to ESD risk, but panel thinness is achieved
Solution Approach 1:
The patent resolves the conflict between thinness and complexity by transitioning from a planar arrangement to a three-dimensional stacked configuration. The first conductive block is positioned in a different layer from the scan signal line, with their orthographic projections overlapping on the substrate. This vertical stacking allows conductive elements to be closely spaced in the thickness direction while maintaining electrical insulation through layer separation, enabling panel thinness without increasing ESD risk or manufacturing complexity.
3Object-affected harmful factors
If transfer pads are added to manage charge storage, then ESD protection is improved, but device complexity increases
Solution Approach 1:
The patent merges the transfer pad with the existing scan signal line structure, making the transfer pad an integral part of the signal line rather than a separate added component. The transfer pad is electrically connected to the scan signal line and positioned to overlap with the first conductive block, combining the functions of signal transmission and charge management into a unified structure. This integration provides ESD protection while minimizing additional device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the risk of short circuits and dark lines on the display panel, enhancing manufacturing reliability and panel quality by effectively managing electrostatic discharge and charge storage.
Implementation Method 1
a first conductive block in the at least one first conductive block is located in a different layer from the scan signal line and electrically insulated from the scan signal line; an orthographic projection of the first conductive block on the substrate at least partially overlaps with an orthographic projection of the transfer pad on the substrate
Implementation Method 2
a transfer pad in the at least one transfer pad is disposed at an end of the wire body
Data Source
AI summary
A display panel includes a substrate, at least one scan signal line and at least one first conductive block. The scan signal line is disposed on the substrate; a scan signal line in the at least one scan signal line includes a wire body and at least one transfer pad, and a transfer pad in the at least one transfer pad is disposed at an end of the wire body. A first conductive block in the at least one first conductive block is located in a different layer from the scan signal line and electrically insulated from the scan signal line; an orthographic projection of the first conductive block on the substrate at least partially overlaps with an orthographic projection of the transfer pad on the substrate.