Display Panel Transfer-Hole Wiring for Narrower Lower Bezels

The patent routes signal lines through the thickness dimension of the substrate by creating transfer holes (first transfer holes and second transfer holes) that penetrate the substrate. This allows signal lines to pass through the substrate thickness rather than traveling laterally across the peripheral area, effectively using the Z-dimension to resolve the contradiction between signal transmission and frame width reduction.

The patent embeds the transfer holes within the substrate structure, nesting the signal transmission path inside the substrate thickness. The first transfer holes and second transfer holes are positioned at different depths within the substrate, creating a nested three-dimensional wiring structure that eliminates the need for wide peripheral routing areas.

The patent divides the transfer hole structure into multiple segments: first transfer holes extending from the first surface to a first depth, and second transfer holes extending from the first surface to a second depth. This segmentation allows for staged manufacturing processes and enables different signal lines to be routed at different depths, optimizing wiring space while managing manufacturing complexity through modular construction.

The patent creates transfer holes with specific local characteristics - different depths, different positions, and different orientations - to optimize signal routing in specific areas. The first transfer holes and second transfer holes have differentiated structures tailored to their specific routing requirements, allowing precise control over signal paths while maintaining overall manufacturing feasibility.