Display Panel Light-Shielding Layout for Micro-LED Transfer Yield
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Solution Overview
Problem
The existing microelement display technology faces challenges such as difficult light-emitting diode transfer, poor binding, low yield, and inconsistent display quality in micro-LED and mini-LED display panels due to issues like high transfer risk and interference from film layers during the microstamp transfer process.
Innovation Solution
A display panel design featuring a substrate with a drive array layer containing first grooves and a light-shielding layer with openings, where the light-shielding layer is partially filled within the grooves, reducing its thickness and improving fluidity, thus enhancing the transfer efficiency and binding yield of light-emitting components by minimizing interference with microstamp operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the light-shielding layer is made thicker to improve light shielding effect, then light shielding performance is improved, but the fluidity during microstamp transfer deteriorates and transfer efficiency decreases
Solution Approach 1:
The light-shielding layer is designed with non-uniform thickness: thicker in regions where strong light shielding is needed (away from light-emitting component positions) and thinner in regions where microstamp transfer occurs (around light-emitting component positions). This local variation in thickness allows the structure to simultaneously achieve effective light shielding and maintain fluidity for transfer operations.
2Productivity
If the light-shielding layer is made thinner to improve fluidity and transfer efficiency, then transfer efficiency is improved, but light shielding performance deteriorates
Solution Approach 1:
The light-shielding layer is designed with non-uniform thickness: thicker in regions where strong light shielding is needed (away from light-emitting component positions) and thinner in regions where microstamp transfer occurs (around light-emitting component positions). This local variation in thickness allows the structure to simultaneously achieve effective light shielding and maintain fluidity for transfer operations.
3Ease of manufacture
If the film layer structure is simplified to reduce manufacturing complexity, then ease of manufacture is improved, but binding yield deteriorates due to poor binding
Solution Approach 1:
The light-shielding layer is pre-formed with a thickness profile that anticipates the transfer process requirements. By preparing the layer with appropriate thickness distribution before the transfer operation, the structure is pre-configured to facilitate smooth microstamp transfer and improve binding yield, eliminating the need for complex post-processing adjustments.
Data Source
AI summary
Provided is a display panel including a substrate, a drive array layer, a light-shielding layer and multiple light-emitting components. The drive array layer is located on a side of the substrate and includes multiple first grooves. The light-shielding layer is located on a side of the drive array layer facing away from the substrate, the light-shielding layer includes multiple first openings, the multiple first openings penetrate through the light-shielding layer, and an orthographic projection of a first groove on the substrate at least partially surrounds an orthographic projection of a respective first opening of the multiple first openings on the substrate. An orthographic projection of a light-emitting component on the substrate at least partially overlaps with an orthographic projection of a respective first opening of the multiple first openings on the substrate. At least part of the light-shielding layer is located within the multiple first grooves.