Via Hole Design for Touch Signal Routing in Display Panels
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Solution Overview
Problem
In display devices with touch functions, the routing of touch signal wires through via holes can be compromised by packaging materials entering the holes during the manufacturing process, affecting electrical connections and signal transmission.
Innovation Solution
A display panel design featuring a first insulating layer with a via hole exposing a metal layer, where a second insulating layer is positioned between the metal layer and the base substrate, with varying distances in the wire routing and display areas to keep the via hole closer to the packaging mask, preventing material entry and enhancing electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the via hole is arranged for routing touch signal wires, then the touch signal transmission is enabled, but packaging materials can easily enter the via hole during manufacturing, affecting electrical connection quality
Solution Approach 1:
The patent applies preliminary action by filling the via hole with filling material before the packaging process. This pre-filled state prevents packaging materials from entering the via hole during subsequent manufacturing steps, thereby maintaining electrical connection quality while still enabling touch signal routing functionality
Solution Approach 2:
The patent introduces filling material as an intermediary substance in the via hole. This filling material acts as a barrier between the packaging materials and the electrical connection, preventing contamination while allowing the touch signal wire to maintain its electrical connection through the via hole
2Productivity
If the via hole is kept open for wire routing, then signal transmission is facilitated, but packaging layer material can enter and affect electrical connection
Solution Approach 1:
The via hole is pre-filled with filling material before the packaging process begins. This preliminary action ensures that when packaging materials are applied later, they cannot enter the via hole, thus maintaining manufacturing precision and electrical connection quality while the via hole remains functional for signal transmission
3Ease of manufacture
If packaging material enters the via hole, then the via hole is blocked, but this affects the electrical connection between touch signal wire and underlying film layer
Solution Approach 1:
The via hole is filled with filling material before the packaging process. This preliminary action prevents packaging materials from entering the via hole during manufacturing, ensuring that the packaging process can proceed smoothly without compromising electrical connection quality
Solution Approach 2:
The filling material serves as an intermediary barrier that allows the packaging process to be performed easily while simultaneously preventing packaging materials from contaminating the via hole and affecting electrical connections
Data Source
AI summary
A display panel includes a display area, a non-display area, a wire routing area, a base substrate, a first insulating layer, a first metal layer, and a second insulating layer. The wire routing area is located in the non-display area. The first metal layer is located between the first insulating layer, including a first via hole exposing at least part of the first metal layer, and the base substrate. The second insulating layer, in contact with the first metal layer, is located between the first metal layer and the base substrate. Along a thickness direction of the display panel, a distance from a side surface of the second insulating layer away from the base substrate to a side surface of the base substrate close to the second insulating layer has D1 in the wire routing area and D2 in the display area, D1>D2>0.